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IntroductionThe small hole mode swing laser welding has gained increasing recognition due to its ability to bridge gaps, refine microstructures, and enhance the mechanical properties of welds. However, the effects of amplitude, frequency, welding speed, laser beam power, and beam radius on heat flux distribution, melting mode, and three-dimensional temperature field have not been well understood. ...
Recently, EO Technologies, a well-known semiconductor laser processing equipment manufacturer in South Korea, is emerging in the glass substrate processing market.It is understood that EO Technologies is entering the glass substrate TGV market based on its UV laser drilling equipment originally used in PCB substrate technology. TGV technology is the core process for drilling holes inside glass sub...
EV Group, a leading supplier of wafer bonding and lithography equipment in the MEMS, nanotechnology, and semiconductor markets, yesterday launched the EVG850 NanoClean layer release system, which is the first product platform to adopt EVG's revolutionary NanoClean technology.The EVG850 NanoClean system combines infrared lasers with specially formulated inorganic release materials, and can ...
As humans stand at the forefront of a new era of space exploration, the National Laboratory of the International Space Station is taking the lead in carrying out a groundbreaking initiative that may completely change the way we understand and utilize space for research and development. In a recent development, Northrop Grumman's 20th commercial supply service mission has become an innovative light...
Recently, Professor Zhang Xiaohong and Professor Peng Jun from the Functional Nanomaterials and Soft Materials Research Institute (FUNSOM) of Suzhou University, along with Professor Mohammad Khaja Nazeeruddin, Professor Paul J. Dyson, Professor Zhaofu Fei, and Professor Ding Yong from North China Electric Power University, collaborated to publish their research findings on Dopant additive synergy ...