Deutsch

The University of California has developed a pioneering chip that can simultaneously carry lasers and photonic waveguides

508
2023-08-10 18:28:38
Übersetzung anzeigen

A team of computer and electrical engineers at UC Santa Barbara, in collaboration with several colleagues at Caltech and another colleague at Anello Photonics, has developed a first-of-its-kind chip that can carry both laser and photonic waveguides. In a paper published in the journal Nature, the team describes how they made the chip and how it worked during testing.

With the advent of integrated circuits, scientists learned to place transistors, diodes, and other components on a single chip, greatly increasing their potential. In the past few years, researchers working on photonics have hoped to achieve the same feat. People in the field say that the development of similar photonic chips could lead to more precise experiments with atomic clocks and could also be used for quantum applications. It will also reduce the need for huge optical platforms.

In order for such a chip to work, it must house both the laser and the photon waveguide. For this purpose, engineers have developed plug-in isolators to prevent reflections and thus avoid instability in the absence of plug-in isolators. Unfortunately, this method requires the use of magnetism, which causes problems in production. In this new effort, the research team found a way to overcome these problems and create the first truly usable composite chip.

To make the chip, the researchers first placed ultra-low loss silicon nitride waveguides on a silicon substrate. They then covered the waveguide with a variety of silicon and installed a low-noise indium phosphate laser on the waveguide. By separating the two components, the team prevented damage to the waveguide during etching.

The team notes that separating the two components also requires the use of a redistribution layer made of silicon nitride to allow interaction between the two components via the evanescent field. The distance formed by the silicon layer between the two components minimizes interference.

The researchers first measured its noise levels to test their chip. They found they were satisfied and then used it to create a tunable microwave frequency generator. They describe their chip as "a critical step toward complex systems and networks on silicon."

Source: Laser Network

Ähnliche Empfehlungen
  • Future oriented strategic technology: integrated manufacturing of large composite materials with additive and subtractive materials and its key elements

    Thermowood has developed a large-scale additive and subtractive material manufacturing equipment, LSAM, and successfully printed tooling molds on site that can be used for aerospace composite material forming, demonstrating its low-cost and rapid response to composite material manufacturing capabilities to the public.As a large-scale component additive manufacturer, Thermowood has developed a near...

    2024-04-19
    Übersetzung anzeigen
  • Intel installs the first EUV manufacturing tool that can emit lasers hotter than the sun

    Chip giant Intel announced that it has completed the assembly work of the world's first commercial high numerical aperture (NA) extreme ultraviolet lithography (EUV) scanner. This device greatly improves the resolution and feature scaling of next-generation chips by changing the optical design used to project printed images onto silicon wafers.This lithography equipment weighing 150 tons has been ...

    2024-04-22
    Übersetzung anzeigen
  • Laser blasting promises to solve global plastic problem

    Recently, researchers announced the development of a way to use laser blasting to break down plastic and other material molecules into their smallest parts for future reuse.This method involves placing these materials on a two-dimensional material called transition metal dichalcogenides and then irradiating them with light.This discovery has the potential to improve the way we handle plastics that...

    2024-07-16
    Übersetzung anzeigen
  • Laser driven leap forward: the next generation of magnetic devices for controlling light is born

    Recently, a new laser heating technology developed by a Japanese research group has paved the way for advanced optical communication equipment by integrating transparent magnetic materials into optical circuits.This breakthrough was recently published in the journal Optical Materials. It is crucial for integrating magneto-optical materials and optical circuits, which has been a significant long-te...

    2023-12-21
    Übersetzung anzeigen
  • The latest progress in laser chip manufacturing

    Modern computer chips can construct nanoscale structures. So far, only these tiny structures can be formed on top of silicon chips, but now a new technology can create nanoscale structures in a layer beneath the surface. The inventor of this method stated that it has broad application prospects in the fields of photonics and electronics, and one day, people can manufacture 3D structures on the ent...

    2024-07-29
    Übersetzung anzeigen