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Trotec Laser, a manufacturer of laser technology in Upper Austria, is opening a new laser cutting competence center. The expanded showroom in Darmstadt now also houses three new large format laser cutters from the SP series. This strategic move is designed to meet the growing demand for large format laser cutting solutions.To celebrate the reopening of the Darmstadt Competence Centre, Trotec will ...
After electronic integrated circuits (Eics), silicon (Si) photonics technology is expected to achieve photonic integrated circuits (PIC) with high density, advanced functions and portability. Although various silicon photonics fountifiers are rapidly developing PIC capabilities to enable mass production of modulators, photodetectors and, more recently, lasers, silicon PIC has not yet met the strin...
With the rapid development of modern electronic information technology, integrated circuit chip packaging forms are also emerging in an endless stream, and the package density is getting higher and higher, which greatly promotes the development of electronic products to multi-function, high performance, high reliability and low cost.So far, through hole technology (THT) and surface mount technolog...
New Product for Wafer Testing Probe Card Manufacturing Equipment Project This project adopts vision guided laser precision cutting to separate the probe from the crystal disk, and then generate a product mapping image for use in the next process. When picking up the probe, multi-point reference surface fitting technology is used to achieve non-contact probe suction and avoid force deformation. A...
Scientists at the Technical University of Munich have made significant progress in measuring the Earth's rotation with unprecedented accuracy. Now, the ring laser from the Wettzell Geodetic Observatory can be used to capture data at a quality level unmatched anywhere in the world. These measurements are crucial for determining the position of the Earth in space, assisting climate research, and imp...