chanelink logo
CHANELINK
English

Veeco's Laser Pulse Annealing (LSA) System Selected for DRAM Evaluation

23
2025-12-03 11:21:40
See translation

Veeco Instruments Inc. (NASDAQ: VECO) announced today that it has delivered its Laser Spike Annealing (LSA) system to a leading semiconductor memory company for evaluation by its advanced DRAM development team. This progress not only expands Veeco's business territory in the DRAM market, but also signifies a key advancement in the development of mass production technology for next-generation DRAM and high bandwidth memory (HBM). The expected evaluation period is about one year, and subsequent orders are expected to be fulfilled gradually from 2027 onwards.

 



“Our LSA platform is engineered to meet the rigorous demands of advanced DRAM and HBM production by providing higher productivity and superior performance,” said Adrian Devasahayam, Ph.D., Veeco’s Senior Vice President, Product Line Management. “This evaluation shipment underscores our commitment to enabling cutting-edge memory technologies, while providing an opportunity to expand our footprint in the memory market with this major customer.”

LSA is a millisecond annealing technology used in front-end semiconductor manufacturing to lower the resistance of key transistor structures by activating dopants. Veeco’s LSA system is capable of high-temperature annealing while staying within reduced thermal budgets of advanced devices at leading-edge nodes. The system delivers market-leading performance and best-in-class cost of ownership, making it a preferred solution for advanced memory applications. As the demand for HBM and DRAM continues to rise—driven by AI workloads and next-generation computing, Veeco’s LSA technology is positioned to support the evolving needs of tier 1 semiconductor manufacturers.

The HBM market is experiencing rapid growth, with Yole market research estimating that the market will grow at a compound annual growth rate (CAGR) of nearly 30% through 2030, reaching $100B or more in annualized revenues.

About Veeco
Veeco (NASDAQ: VECO) is an innovative manufacturer of semiconductor process equipment. Our proven ion beam, laser spike annealing, lithography, MOCVD and single wafer etch & clean technologies play an integral role in the fabrication and packaging of advanced semiconductor devices. With equipment designed to optimize performance, yield and cost of ownership, Veeco holds leading technology positions in the markets we serve. 

Source: GlobeNewswire

Related Recommendations

  • Researchers have developed the world's smallest silicon chip quantum photodetector

    Researchers at the University of Bristol have made significant breakthroughs in expanding quantum technology by integrating the world's smallest quantum photodetector onto silicon chips. The paper "A Bi CMOS Electron Photon Integrated Circuit Quantum Photodetector" was published in Science Advances.In the 1960s, scientists and engineers were able to miniaturize transistors onto inexpensive microch...

    2024-05-21
    See translation

  • Laser link between European Space Agency containers and space

    The latest expansion of the European Space Agency's laboratory is essentially portable: this European Space Agency's mobile optical ground station is housed in a standard container and can be transported throughout Europe as needed for laser based optical communication with satellites - including NASA's Psyche mission, in space millions of kilometers away.The station has officially become a part o...

    2024-02-12
    See translation

  • Michigan State University uses laser pulses to impact gold nanoparticles for crystal growth

    To make crystals suitable for use as optoelectronic materials, the key is to precisely control the crystallization, but this control is difficult.Producing lead halide perovskites, promising components for next-generation solar cells and photodetectors, has proven particularly challenging, with slow growth rates and uncontrolled nucleation being common issues.A project at Michigan State University...

    10-16
    See translation

  • Photonic hydrogel of high solid cellulose with reconfigurability

    Recently, Qing Guangyan, a researcher team from the Research Group on Bioseparation and Interface Molecular Mechanism (1824 Group) of Biotechnology Research Department of Dalian Institute of Chemical Physics, Chinese Academy of Sciences, designed and prepared a highly solid cellulose photonic hydrogel with reconfigurability and mechanical discoloration. This preparation method opens up a new way t...

    02-17
    See translation

  • Short pulse lasers in the form of chips use the so-called mode coupling principle

    Nowadays, lasers that emit extremely short flashes can be found in many research laboratories, but they usually fill the entire room. Physicists have now successfully reduced this laser to the size of a computer chip. As they reported in the journal Science, their research can lay the foundation for extremely compact detectors.A team led by Qiushi Guo from the California Institute of Technology in...

    2023-11-10
    See translation