English

Tescan acquires ultrafast laser company FemtoInnovations

35
2025-11-18 10:48:03
See translation

To strengthen its strategic layout in the field of ultrafast laser technology, Tescan Group officially announced today that it has completed the acquisition of industry innovation company FemtoInnovations and established a new Laser Technology Business Unit (LT BU) based on it. The new department headquarters will be located in the UConn Science Park, aiming to integrate the technological advantages of both parties and significantly expand Tescan's portfolio of related and multimodal products in the semiconductor, biomedical equipment manufacturing, and advanced research markets.

 



FemtoInnovations brings to Tescan a unique and disruptive laser platform - technology already proven in demanding workflows and attracting strong interest from leading global players across semiconductors, advanced manufacturing, and high-tech industries.

“Bringing FemtoInnovations into the Tescan family is a strategic step that strengthens our ability to deliver end-to-end workflows. By combining ultrafast laser micromachining with our leading imaging and analysis platforms, we’re enabling customers to move faster from problem to insight across failure analysis, sample preparation, R&D, and advanced manufacturing,” said Jean-Charles Chen, Chief Executive Officer, Tescan Group.

Tescan will unveil the portfolio at ISTFA 2025 (Pasadena, CA) in November.

 “Our team has always been driven by the pursuit of innovation and the development of disruptive laser processing technologies. By combining our ultrafast laser systems with Tescan's leading imaging and analysis platforms, we are creating a powerful new dimension of integrated workflows. This partnership will accelerate discovery and redefine what's possible for our customers. We are excited to combine forces and contribute to Tescan's legacy of excellence and innovation,” said Sina Shahbazmohamadi, Co-Founder, FemtoInnovations.

The Laser Technology BU will be headquartered at the University of Connecticut Tech Park (UConn), tapping into its research ecosystem, talent and infrastructure. It will work in close synergy with Tescan’s Electron Microscopy and Micro-CT business units to deliver integrated workflows beginning in 2026.

A new FLAME Center (FemtoInnovations Laser Advanced Manufacturing & Engineering) will be established at the Innovation Partnership Building of UConn Tech Park to fast-track R&D, applications and workflow development.

From a strategy standpoint, the decision centered on three things: the caliber of the FemtoInnovations team, the maturity of its ultrafast-laser platform for real-world workflows, and a clear cultural fit with customer-driven problem solving.

“We are constantly looking for partners who not only bring deep engineering discipline but also an unmatched innovation power. FemtoInnovations' disruptive laser processing technologies and their ability to create a platform that’s ready for real-world use is exactly the kind of strategic fit that raises the bar for our customers. We’re pleased to welcome the team into the Tescan family,” said Bruno Janssens, Chief Strategy Officer, Tescan Group, who led the strategic evaluation of the FemtoInnovations transaction and will support the integration of the new Laser Business Unit into the Tescan organization.

“We are excited about this unique industry-academia partnership that will allow talent development, innovation, and industrialization of advanced laser technologies with applications in semiconductors and biomedical devices,” said Dr. Emmanouil Anagnostou, Executive Director of the UConn Tech Park.

Source: AZOM

Related Recommendations
  • Japan's Murata Machinery Launches a Punch and 4kW Fiber Laser Integrated System

    Recently, Murata Machinery USA, a representative Japanese manufacturer of machinery and CNC machine tools, announced the launch of the latest cutting-edge punch and fiber laser integrated equipment - MF3048HL. This integrated machine combines the advantages of punch operation and laser cutting technology, eliminating the need for separate settings or material transfer between machines.Muratec's pu...

    2023-09-01
    See translation
  • 国内自主研发首套碳化硅晶锭激光剥离设备投产

           近日,从江苏通用半导体有限公司传来消息,由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司,并投入生产。 图:8英寸SiC晶锭激光全自动剥离设备       该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片,包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集,一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白,突破了国外的技术封锁,将极大地提升我国碳化硅芯片产业的自主化、产业化水平。       该设备年可剥离碳化硅衬底20000片,实现良率95%以上,与传统的线切割工艺相比,大幅降低了产品损耗,而设备售价仅仅是国外同类产品的1/3。       近年来,碳化硅功率器件在大功率半导体市场中所占的份额不断提高,并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...

    2024-08-26
    See translation
  • Guangfeng Technology releases the world's first versatile laser headlights

    On April 25th, 2024, the Beijing International Auto Show officially opened, and Guangfeng Technology released the world's first ALL-IN-ONE all-around laser headlights.This headlight is the first to integrate multiple functions such as high beam ADB headlights, color changing temperature headlights, fog lights, ground information display, car cinema, etc. into a small volume headlight module, achie...

    2024-04-29
    See translation
  • Researchers have created the first organic semiconductor laser that can be operated without the need for a separate light source

    Researchers at the University of St. Andrews in Scotland have manufactured the first organic semiconductor laser to operate without the need for a separate light source - which has proven to be extremely challenging. The new all electric driven laser is more compact than previous devices and operates in the visible light region of the electromagnetic spectrum. Therefore, its developers stated that...

    2023-11-15
    See translation
  • Trumpf and SiMa. ai collaboration to develop AI laser

    Recently, Trumpf Group, a leading global provider of machine tools and laser technology solutions, announced that it has partnered with software company SiMa AI has signed a partnership agreement to develop lasers with artificial intelligence (AI).It is reported that SiMa. ai is a software centric embedded edge machine learning chip system company, and the goal of both parties is to equip Trumpf'...

    2024-07-19
    See translation