- 暫無數據
繁体中文
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
backgroundThe Jörg Debus team from the Technical University of Dortmund in Germany is dedicated to researching optical quantum information processing and quantum sensing in materials with potential applications. The team mainly studies the fine structure of materials under light fields, such as quantum dots, quantum effects of two-dimensional materials, semiconductor defects in diamonds, and ...
Recently, the research team of Aerospace Laser Technology and System Department of Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, based on 2.1 μ M Ho: YAG main oscillator amplifier pumped ZGP crystal, achieving high energy 3-5 at kHz repetition frequency μ The output of M medium wave infrared laser and further research on beam quality improvement technology for high-...
Figure: a. Schematic diagram of the HCF-LN-CPPLN experimental setup. W. CaF? Window M, mirror.b. The bright white light circular spots emitted by the CPPLN sample.c. The first-order diffraction beam of B displays a colorful rainbow pattern from purple to red.d. The HCF-LN-CPPLN module generates normalized spectra of the output full spectrum laser signal through the second NL HHG and third NL SPM e...
Laser cladding technology, also known as laser additive manufacturing technology, uses high-energy laser as the heat source and metal alloy powder as the cladding material. Through the synchronous action of laser and alloy powder on the metal surface, it quickly melts to form a molten pool, and rapidly solidifies to form a dense, uniform, and controllable thickness metallurgical bonding layer, the...
Recently, Halo Industries, an innovative technology company based in California, announced that it has successfully raised $80 million in Series B venture capital, marking a significant breakthrough in its use of laser technology to revolutionize the production of silicon carbide (SiC) semiconductor wafer substrates.This financing is led by the US Innovation Technology Fund (USIT) and involves hea...