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EV Group, a leading supplier of wafer bonding and lithography equipment in the MEMS, nanotechnology, and semiconductor markets, yesterday launched the EVG850 NanoClean layer release system, which is the first product platform to adopt EVG's revolutionary NanoClean technology.The EVG850 NanoClean system combines infrared lasers with specially formulated inorganic release materials, and can ...
On August 31st, Tianjin Kaipulin Optoelectronics Technology Co., Ltd. (hereinafter referred to as Kaipulin), a Tianjin Port Free Trade Zone enterprise, officially released the world's first 200000 watt ultra-high power industrial grade fiber laser, breaking the record for the highest power of industrial grade fiber lasers in the world and marking China's stable position in the international advanc...
Main author: Yanming Zhang, Wentao Yana*The first unit: National University of SingaporePublished Journal: Acta MaterialiaResearch backgroundIndustry pain point: Although laser powder bed melting (LPBF) technology can manufacture complex components, the lack of consistent product quality is still the core bottleneck restricting its industrial application. Research has shown that up to 35% of proce...
On August 14th local time, Veeco Instruments, a well-known American laser annealing manufacturer, announced an important cooperation with technology giant IBM. It is reported that IBM has selected Veeco Instruments' WaferStorm wet processing system as support for its advanced packaging applications, and the two parties have signed a joint development agreement to explore the potential of utilizi...
Researchers from the Laser Processing Group of the IO-CSIC Institute of Optics in Spain report on the application of multi-purpose femtosecond laser interference in high-precision silicon nanostructures. The related research was published in Optics&Laser Technology with the title "Versatile femtosecond laser interference pattern applied to high precision nanostructured of silicon".Highlights:...