Veeco Instruments wins IBM big order

On August 14th local time, Veeco Instruments, a well-known American laser annealing manufacturer, announced an important cooperation with technology giant IBM.

It is reported that IBM has selected Veeco Instruments' WaferStorm wet processing system as support for its advanced packaging applications, and the two parties have signed a joint development agreement to explore the potential of utilizing Veeco's various wet processing technologies in advanced packaging applications.

According to the agreement, the WaferStorm wet processing system will be installed at the Albany NanoTech integrated plant in Albany, New York, which is a base for cutting-edge research and development in advanced packaging and chip technology by IBM and other ecosystem partners.

The WaferStorm system supports critical hybrid bonding cleaning processes such as photoresist stripping, temporary bonding stripping, and pre bonding cleaning, with defect rates controlled at 40 nanometers and 60 nanometers.

The ImmJET multi wafer immersion and high-pressure jet technology of WaferStorm wet processing system can perform multiple processes on a flexible platform, and the platform can handle multiple wafer sizes and thicknesses with minimal hardware modifications required.

Mathew Abraham, Vice President of Wet Processing Products at Veeco Instruments, has high expectations for this collaboration: "Joining hands with IBM not only demonstrates Veeco's determination to drive technological innovation in key areas such as cloud computing and AI alongside top equipment manufacturers, but also marks another leap forward for our high-capacity, low-cost innovation platform in the field of advanced packaging.

The unique advantages of ImmJET solvent technology, combined with our platform's excellent process capabilities and cost-effectiveness, have laid a solid foundation for deepening cooperation between both parties and jointly leading the technological boundaries.

The WaferStorm system stands out in wet processing applications in multiple key markets such as advanced packaging, MEMS, RF, data storage, and photonics due to its unparalleled flexibility, becoming the industry's preferred choice. This system widely supports various processes such as metal stripping, photoresist and flux cleaning, scrubber, and TSV cleaning, ensuring optimal performance for applications such as photoresist stripping and dry film stripping with excellent performance and low cost of ownership. It is the best choice for innovation seekers.

Veeco Instruments is an innovative manufacturer of semiconductor process equipment, with a product line covering multiple fields such as laser annealing, ion beam, CVD, MOCVD, single crystal circular etching and cleaning, and photolithography technology, providing indispensable technical support for the manufacturing and packaging of advanced semiconductor devices.

Recently, this laser annealing manufacturer released its financial report for the second quarter of the 2024 fiscal year ending on June 30, 2024. According to the financial report, Veeco Instruments' revenue for this quarter was $175.9 million, an increase of 8.85% compared to $161.6 million in the same period last year.

Among them, GAAP net profit was $14.9 million, equivalent to diluted earnings per share of $0.25; And the net loss for the same period last year was $85.3 million, equivalent to a diluted loss of $1.61 per share. GAAP net profit increased by 117.47% year-on-year.

Non GAAP net profit was $25.4 million, or $0.42 diluted earnings per share, compared to $20.6 million, or $0.36 diluted earnings per share, in the same period last year. Non GAAP net profit increased by 23.30%.

Source: OFweek