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The researchers estimate the period from 2023 to 2028. EUV lithography will address the limitations of traditional optical lithography, which has reached its physical limits in terms of resolution. The shorter wavelength of EUV light allows for the creation of smaller features and tighter patterns on silicon wafers, enabling the manufacture of advanced microchips with greater transistor densities....
Leica Geosystems, a subsidiary of Hexagon, has developed Leica BLK2GO PULSE, its first person laser scanner, which combines LiDAR sensor technology with the original Leica BLK2GO shape. The technology will be released in early 2024.The scanner provides users with a fast, simple, and intuitive first person scanning method that can be controlled through a smartphone and provides real-time full color...
Recently, the State Key Laboratory of Intense Field Laser Physics of the Chinese Academy of Sciences Shanghai Institute of Optics and Fine Mechanics has made new progress in generating intense field terahertz waves based on Yb laser pumped organic crystals. The relevant research results were published in Applied Physics Letters under the title "Efficient strong field THz generation from DSTMS crys...
Imagine being able to carry a 3D printer with you and quickly create low-cost objects, such as fastening bicycle wheels or parts needed for critical medical surgeries. Scientists from the Massachusetts Institute of Technology (MIT) and the University of Texas at Austin have combined silicon photonics and photochemical technology to successfully develop the first chip based 3D printer, taking a cru...
Recently, Associate Professor Li Mujun from the School of Engineering Sciences and the Institute of Humanoid Robotics at the University of Science and Technology of China, together with researchers such as Professor Zhang Shiwu, has made significant progress in the field of intelligent material 3D printing. The research team proposed composite cold field 3D printing technology and successfully pre...