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Recently, DIT, a well-known semiconductor and display equipment manufacturer in South Korea, announced that the company has signed an agreement worth 20.52 billion Korean won to supply wafer processing equipment to SK Hynix. According to DIT, the equipment supplied to SK Hynix this time is mainly a laser annealing kit. DIT was founded in 2005 and was listed on KOSDAQ in 2018. Its main focus is o...
It is reported that the National Institutes of Sciences (INRS) of Canada has developed a camera platform that can achieve cheaper ultra fast imaging through the use of ready-made components, which can be used in various applications.This new device aims to address some of the limitations of current high-speed imaging, including parallax errors and potential damage from pulse illumination. Th...
With the development of cutting-edge technologies such as automatic guidance and embodied intelligence, machine vision has put forward higher requirements for image acquisition, requiring precise recording of static images and the ability to sensitively capture dynamic changes in the scene. The existing dynamic and active pixel sensor technology integrates two functions: dynamic event detection an...
EV Group, a leading supplier of wafer bonding and lithography equipment in the MEMS, nanotechnology, and semiconductor markets, yesterday launched the EVG850 NanoClean layer release system, which is the first product platform to adopt EVG's revolutionary NanoClean technology.The EVG850 NanoClean system combines infrared lasers with specially formulated inorganic release materials, and can ...
In a groundbreaking scientific study published in Volume 13 of the Scientific Report, researchers reported on the results of Young's double slit interference experiment using oscillating vortex radiation under a photon counting system. The experiment involves using a spiral oscillator to emit second harmonic radiation in the ultraviolet range. Using an ultra narrow bandpass filter in the low curre...