Thorlabs announces acquisition of Praevium Research

After electronic integrated circuits (Eics), silicon (Si) photonics technology is expected to achieve photonic integrated circuits (PIC) with high density, advanced functions and portability. Although various silicon photonics fountifiers are rapidly developing PIC capabilities to enable mass production of modulators, photodetectors and, more recently, lasers, silicon PIC has not yet met the strin...

When it comes to additive manufacturing, some people may not have heard of it, but when it comes to its other name: 3D printing, no one is unaware.In fact, the name 'additive manufacturing' better illustrates the essence of this processing method. From ancient times to the present, humans have put in great effort to achieve the goal of processing 'raw materials into the shapes we need'. From the S...

In order to maintain relevance and success, companies with a long history must respect their past while not ignoring the future. This is the method adopted by Cincinnati Corporation (CI), a metal processing machinery manufacturer based in Harrison, Ohio, since its establishment in the late 1890s.The company is carefully considering technological changes. Incorrect selection of control hardware, ne...

A team of researchers in Berkeley Lab's Accelerator Technology and Applied Physics (ATAP) division has developed a new technique that combines fiber lasers of different wavelengths to generate ultra-short laser pulses. The research is in the journal Optics Letters.This work could advance the development of laser plasma accelerators (LPA), which have the potential to push the frontiers of high-en...

       近日，从江苏通用半导体有限公司传来消息，由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司，并投入生产。 图：8英寸SiC晶锭激光全自动剥离设备       该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片，包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集，一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白，突破了国外的技术封锁，将极大地提升我国碳化硅芯片产业的自主化、产业化水平。       该设备年可剥离碳化硅衬底20000片，实现良率95％以上，与传统的线切割工艺相比，大幅降低了产品损耗，而设备售价仅仅是国外同类产品的1／3。       近年来，碳化硅功率器件在大功率半导体市场中所占的份额不断提高，并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...