- No Data
English
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
Due to the increasing threat of space debris in low Earth orbit around the Earth, space agencies around the world are becoming increasingly concerned about this. According to a new study funded by the National Aeronautics and Space Administration (NASA), it may be possible to send space debris that may be at risk of colliding with orbiting spacecraft to safer orbits through a laser network deploye...
1. Research backgroundDirected energy deposition (DED), as an efficient and economical technology in the field of additive manufacturing (AM), is widely used in the manufacturing of metal materials. However, its high heating and cooling rates, as well as significant temperature gradients, often lead to rapid solidification, forming cross layer columnar grains and internal defects, seriously affect...
Recently, additive manufacturing research company AM Research released its latest quarterly data and forecast report, which deeply analyzes the latest developments in the global 3D printing market, covering multidimensional analysis of suppliers, printing technology, geographic location, and application areas.According to the report, the global 3D printing market once again demonstrates strong gro...
Recently, Confluence Networks LLC has announced a long-term partnership agreement with Laser Light Communications Inc., a developer and provider of software controlled optical network services.According to the agreement, Laser Light will adopt Confluence-1 submarine fiber optic network, which Confluence Networks is about to launch, as the core part of its global network. The protocol will last for...
In today's technology field, Juguang Technology released two highly anticipated high-power semiconductor lasers on December 13th: GS09 and GA03. These two products are leading the innovation wave in the laser industry with their miniaturized design, excellent thermal management capabilities, and extensive customization flexibility.GS09 revolutionizes chip spacing by compressing the width of the st...