Trumpf announces four personnel changes

Recently, Professor Xu Tingfa's research team from the School of Optoelectronics at Beijing Institute of Technology and Assistant Professor Lin Xing's team from Tsinghua University jointly developed a new type of Opto Intelligence Spectrometer (OIS). The device is based on diffractive neural network technology and achieves precise spectral reconstruction under spatially coherent or spatially incoh...

Recently, a research team from the University of California, Santa Barbara has successfully developed a new type of photonic memory computing device that integrates non reciprocal magneto-optical technology. This device achieves high-speed, high-energy efficiency, and ultra-high durability photon computing by utilizing the non reciprocal phase shift phenomenon. The research findings, titled "Integ...

The development of additive manufacturing (AM) has profoundly changed the manufacturing industry, and this technology has been applied in fields such as food, medicine, automotive, and electronic components. Especially in the aerospace field, where extremely lightweight and high-strength (~500mpa) components are required, aluminum alloy additive manufacturing is considered a very promising solutio...

Recently, a group of researchers from the University of Cambridge developed an innovative method of using high-energy lasers to improve 3D printing of metals. This discovery has the potential to change the way we design and manufacture complex metal objects.3D printing has completely changed the landscape of the manufacturing industry. However, it faces obstacles, especially in terms of the charac...

       近日，从江苏通用半导体有限公司传来消息，由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司，并投入生产。 图：8英寸SiC晶锭激光全自动剥离设备       该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片，包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集，一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白，突破了国外的技术封锁，将极大地提升我国碳化硅芯片产业的自主化、产业化水平。       该设备年可剥离碳化硅衬底20000片，实现良率95％以上，与传统的线切割工艺相比，大幅降低了产品损耗，而设备售价仅仅是国外同类产品的1／3。       近年来，碳化硅功率器件在大功率半导体市场中所占的份额不断提高，并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...