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According to South Korean media etnews, Samsung Electronics and SK Hynix have started the process technology conversion of high bandwidth memory (HBM) wafers, with the introduction of new technologies to prevent wafer warping as the core, which is considered to be aimed at the next generation HBM. It is expected that with the process transformation, the material and equipment supply chain will als...
According to foreign media reports, scientists from the Physics Research Institute and the Institute of Physics and the Center for Quantum Science and Engineering at the Swiss Federal Institute of Technology Lausanne (EPFL) in Lausanne, Switzerland have made a new progress in the field of excitation science, developing a smaller and quieter laser system than previous products.Small laser system (I...
Laser plays an important role in fields such as photonic chips, laser displays, and in vehicle radars. Organic materials have advantages such as molecular diversity, energy level richness, heterogeneous compatibility, and ease of processing. They have significant advantages in the construction of high-performance and multifunctional lasers and are expected to further innovate laser technology and ...
EV Group, a leading supplier of wafer bonding and lithography equipment in the MEMS, nanotechnology, and semiconductor markets, yesterday launched the EVG850 NanoClean layer release system, which is the first product platform to adopt EVG's revolutionary NanoClean technology.The EVG850 NanoClean system combines infrared lasers with specially formulated inorganic release materials, and can ...
Recently, the research team of the High Power Laser Element Technology and Engineering Department of the Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, has made new progress in evaluating the laser damage resistance and damage mechanism of 532nm thin film polarizers using different laser damage test protocols. The related achievements were published in Optical Materi...