- No Data
English
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
Recently, AP Systems, a well-known laser manufacturer in South Korea, established a new AVP equipment division for the advanced packaging field. This business unit will focus on laser equipment required for advanced packaging processes of high bandwidth memory (HBM).AP Systems is a subsidiary of APS Group, mainly focused on the fields of display and semiconductor laser processing equipment. It foc...
From September 12 to 14, 2023, IPG Photonics, a well-known fiber laser technology leader in the United States, will showcase its latest innovative laser solutions at the Battery Show in Michigan, USA. IPG will also showcase industry-leading fiber laser sources and automated laser systems for electric vehicle battery welding applications.New laser technology pushes the limits of battery welding spe...
In recent years, the performance of Chinese laser technology enterprises in the international market has become increasingly eye-catching. On September 20th, under the joint witness of nearly a hundred customer representatives from various industries in South Korea, the opening ceremony of Zhuolai Laser South Korea Branch was officially held.The branch is located in the Gyeonggi do region of south...
Laser coding and marking technology expert DataLase has launched a series of new colorless to white coatings for a range of packaging applications.These coatings are centered around biodegradable and sustainably sourced raw materials, providing high contrast white printing even on difficult substrates such as 12 micron PET and shrink film, under the weight of flexographic and gravure coatings. Thi...
On August 14th local time, Veeco Instruments, a well-known American laser annealing manufacturer, announced an important cooperation with technology giant IBM. It is reported that IBM has selected Veeco Instruments' WaferStorm wet processing system as support for its advanced packaging applications, and the two parties have signed a joint development agreement to explore the potential of utilizi...