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Researchers from Annamarai University in India and South Ural State University in Russia reported a comparative study of resistance spot welding and laser spot welding of ultra-high strength steel for automobiles. The related research was published in The International Journal of Lightweight Materials and Manufacturing under the title "A comparative study on resistance spot and laser beam spot wel...
The National Science Foundation (NSF) of the United States has awarded the University of Rochester nearly $18 million for three years to design and prototype key technologies for EP-OPAL, a new facility dedicated to studying the interaction between ultra-high intensity lasers and matter.After the design project is completed, the facility can be built at the Laser Energy Laboratory (LLE). This fund...
Recently, AP Systems, a well-known laser manufacturer in South Korea, established a new AVP equipment division for the advanced packaging field. This business unit will focus on laser equipment required for advanced packaging processes of high bandwidth memory (HBM).AP Systems is a subsidiary of APS Group, mainly focused on the fields of display and semiconductor laser processing equipment. It foc...
Chip giant Intel announced that it has completed the assembly work of the world's first commercial high numerical aperture (NA) extreme ultraviolet lithography (EUV) scanner. This device greatly improves the resolution and feature scaling of next-generation chips by changing the optical design used to project printed images onto silicon wafers.This lithography equipment weighing 150 tons has been ...
Advanced laser and plasma solution provider E&R Engineering Corp. has confirmed that they will participate in the Semiconductor SEA 2024 event held in Kuala Lumpur, Malaysia. With 30 years of focus in the semiconductor industry, E&R has developed a wide range of plasma and laser technologies. At Semicon SEA 2024, they will showcase their latest solutions, including:Plasma Cutting - Small M...