GlobalFoundries collaborates with Corning to develop co packaged optical devices

Chip manufacturer GlobalFoundries (GF) has partnered with fiber optic giant Corning to provide co packaged optical (CPO) interconnects for artificial intelligence data centers.

The firms say that Corning’s “GlassBridge” technology, a glass-waveguide based edge-coupler compatible with the v-grooves used in GF’s silicon photonics platform, is wanted for high-bandwidth, power-efficient optical links.

“Other coupling mechanisms are also being developed, including a vertically-coupled detachable fiber-to-PIC (photonic integrated circuit) solution - demonstrating GlobalFoundries and Corning’s combined ability to produce multiple forms of co-packaged PIC-to-fiber connectivity,” they announced.

The technology is due to be showcased at this week’s ECOC 2025 event taking place in Copenhagen, Denmark, and at GlobalFoundries’ forthcoming technology summit in Munich, Germany.

Silicon photonics

Powerful combination
“Our collaboration with Corning marks a significant step forward in delivering next-generation connectivity solutions for AI and machine learning,” said Kevin Soukup, senior VP of GF’s silicon photonics product line.

“Corning’s cutting-edge fiber technology, integrated with our silicon-proven platform, delivers the performance and flexibility required for enabling scalable, high-density optical packaging for AI datacenters.”

Claudio Mazzali, Corning’s VP of global research, added: “Our collaboration with GlobalFoundries is helping to shape the future of AI infrastructure and accelerate the progress needed to meet the demands of an increasingly data-driven world.

“There’s something truly powerful in combining GlobalFoundries’ and Corning’s expertise in silicon process and optical connectivity - together, we’re enabling new possibilities for the AI-powered industries of tomorrow.”

The approach will take advantage of Corning’s expertise in glass, optical fiber and connectivity technologies, including laser processing and so-called fiber array units (FAUs), where fibers with ultra-precise core alignments minimize insertion loss for data center and high-performance computing deployments.

“Built on GF’s comprehensive silicon photonics platform that supports CPO solutions for scale-out and scale-up networks, this collaboration will pair Corning’s well-established supply chain and leadership in optical interconnect technologies with GF’s high-volume manufacturing capabilities and leadership in silicon photonics,” the pair stated.

SPAD sensor production
Meanwhile, GF has also struck a deal with Taiwan-based fingerprint sensor firm Egis Technology to produce a new time-of-flight sensor built around a single-photon avalanche diode (SPAD) detector.

Egis first partnered with GF in 2022 as a strategic move as it entered the emerging market for 3D sensing.

Applications of the firm’s new front-side illuminated (FSI) SPAD technology are said to include laser-assisted auto focus for smart mobile devices, laptops and projectors, presence detection for smart appliances and buildings to enable power-saving features, and collision avoidance in robots and drones.

“GF is committed to enabling the future of smart sensing technologies with solutions like our FSI SPAD device that delivers significant performance and design advantages for next-generation, intelligent sensors,” said Kamal Khouri, senior VP of GF’s feature-rich CMOS product line.

“Through our partnership with Egis, we are excited to bring these advanced direct time-of-flight sensors to the growing marketplace of devices that rely on precise data capture in our increasingly automated world.”

Source: optics.org