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By using a new type of laser, the processing speed of wafers can be 10 to 20 times faster than before. This is the result of a research project at the Fraunhofer Institute for Solar Systems in Germany.Researchers have developed a prototype that can use ultraviolet waves to carve the most intricate structures on silicon wafers. The new system concept enables solar cell manufacturers to perform lase...
According to South Korean media etnews, Samsung Electronics and SK Hynix have started the process technology conversion of high bandwidth memory (HBM) wafers, with the introduction of new technologies to prevent wafer warping as the core, which is considered to be aimed at the next generation HBM. It is expected that with the process transformation, the material and equipment supply chain will als...
The research teams from the Laser Fusion Research Center of the Chinese Academy of Engineering Physics, the Beijing Institute of Applied Physics and Computational Mathematics, Peking University, and Shenzhen University of Technology reported experimental verification of the driving pressure enhancement and smoothing of hybrid driven inertial confinement fusion on a 100 kJ laser equipment.The relev...
Topological laser (TL) is a laser device designed and manufactured using the principles of topological optics, which can produce a robust single-mode laser and is an ideal light source for future new optoelectronic integrated chips. Electrically pumped topology lasers have become a research hotspot due to their small size and ease of integration, but topology lasers based on electrical injection a...
At the UpakExpo 2024 exhibition to be held in Moscow at the end of January, Chinese company Golden Laser will showcase for the first time two laser die-cutting machines focused on the printing, labeling, and packaging markets in Russia.The Golden Laser LC350 is a web machine designed to handle labels printed on digital and flexographic printing machines. It can cut, die cut, and kiss cut paper, pl...