An advanced laser processing laboratory for semiconductor materials and an all solid-state advanced laser research center will be established here

On October 15th, the Laipu Technology National Headquarters and Integrated Circuit Equipment R&D and Manufacturing Base project successfully held a groundbreaking ceremony in the Chengdu High tech Zone.

Project Business Card
Total project investment:
1.66 billion yuan
Project area:
Covering an area of 39 acres, with a construction area of 65000 square meters
Project Planning:
Construction will begin in October 2023, and it is expected to pass parallel completion and acceptance before May 2025. It will be fully put into production by May 2026.

Main construction content:
The Lepu Technology National Headquarters and Integrated Circuit Equipment R&D and Manufacturing Base Project (i.e. Chengdu Lepu Technology Co., Ltd. Headquarters and Production Base Construction Project) includes the enterprise's national headquarters, technology center, manufacturing center, service center, and core component R&D and industrialization base. It will also simultaneously build the Chengdu Semiconductor Materials Advanced Laser Processing Technology Joint Laboratory and Training Base of the Institute of Semiconductors of the Chinese Academy of Sciences Sichuan Province All Solid State Advanced Laser Engineering Technology Research Center and other projects.

The implementation of the project will strongly promote the progress of laser equipment and technology in China's semiconductor field, according to the company. It has played a positive role in the innovation of integrated circuit manufacturing processes, application and system integration of advanced laser technology, independent and controllable core components, and professional talent cultivation.

The person in charge of Lepu Technology stated that
As a highland for industrial development in Chengdu, the Chengdu High tech Zone vigorously promotes new industrialization and continues to promote the localization of semiconductor equipment and materials.

Bird's-eye view of Chengdu High tech West Zone

In March of this year, the Chengdu High tech Zone released the "Chengdu High tech Zone Integrated Circuit Construction Circle and Strong Chain Three Year Plan (2023-2025)" (draft for soliciting opinions), following the overall idea of "supplementary manufacturing, strong design, expansion testing, and chain extension", with analog chips as the core and computing chips, storage chips, and power devices as the focus, to build a large-scale, technologically strong, and factor complete integrated circuit industry chain, and accelerate the construction of the "China Storage Valley". Strive to achieve a scale of over 170 billion yuan in the integrated circuit industry by 2025.

Source: Laser Network