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On August 14th local time, Veeco Instruments, a well-known American laser annealing manufacturer, announced an important cooperation with technology giant IBM. It is reported that IBM has selected Veeco Instruments' WaferStorm wet processing system as support for its advanced packaging applications, and the two parties have signed a joint development agreement to explore the potential of utilizi...
The disruptive miniaturization design of fiber lasers is feeding back into the handheld laser welding market. The handheld laser welding that enters the trunk is bathed in the luster of black technology, making traditional argon arc welding and electric welding tremble.In the early years, argon arc welding was the most commonly used thin plate welding method among our ancestors, but its drawbacks ...
Researchers at the Federal Institute of Technology in Lausanne have resolved the long-standing debate surrounding laser additive manufacturing processes through a groundbreaking defect detection method.The development of laser additive manufacturing is often hindered by unexpected defects. Traditional monitoring methods, such as thermal imaging and machine learning algorithms, have shown significa...
近日,从江苏通用半导体有限公司传来消息,由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司,并投入生产。 图:8英寸SiC晶锭激光全自动剥离设备 该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片,包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集,一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白,突破了国外的技术封锁,将极大地提升我国碳化硅芯片产业的自主化、产业化水平。 该设备年可剥离碳化硅衬底20000片,实现良率95%以上,与传统的线切割工艺相比,大幅降低了产品损耗,而设备售价仅仅是国外同类产品的1/3。 近年来,碳化硅功率器件在大功率半导体市场中所占的份额不断提高,并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...
Pursuing higher speed is not just exclusive to athletes. Researchers can also achieve such feats through their findings. The research results of Professor Liang Jinyang and his team from the National Institute of Science (INRS) have recently been published in the journal Nature Communications.The team located at the INRS É nergie Mat é riaux T é l é communications resea...