Türkçe

Due to breakthroughs in microchip photonics, microwave signals have now become very accurate

221
2024-04-01 14:12:55
Çeviriyi gör

Zhao Yun/Columbia Engineering Company provided an advanced schematic of a photonic integrated chip, which aims to convert high-frequency signals into low-frequency signals using all optical frequency division.

Scientists have built a small all optical device with the lowest microwave noise ever recorded on integrated chips.


In order to improve the performance of electronic devices used for global navigation, wireless communication, radar, and precise timing, reliable microwave sources must be used as clocks and information carriers. To achieve this, it is necessary to minimize phase change noise or random fluctuations to the greatest extent possible.

David M. Rickey, Professor of Applied Physics and Materials Science and Professor of Electrical Engineering at Columbia Institute of Engineering, Alexander Gaeta, reported that a technology called optical frequency division has produced the lowest noise microwave signal in the past decade.
Optical frequency division is the latest innovation used to generate low signal strength microwaves, but its low noise level makes it unsuitable for small sensing and communication applications that require more compact microwave sources.

Gaeta announced that they have created a device that can accurately achieve optical frequency division on a chip using a single laser in a space as small as 1 mm2. This is a breakthrough that simplifies device design.
Gaeta's team focuses on quantum and nonlinear photonics, with a focus on studying the interaction between lasers and matter. The areas of interest include nonlinear nanophotonics, frequency comb generation, ultrafast pulse interactions, and the generation and processing of quantum states of light.
He and his colleagues developed and constructed an all optical on-chip device that uses a silicon nitride microresonator connected by two photons to generate a 16 GHz microwave signal, with frequency noise being the lowest recorded frequency in integrated chip platforms.

The input wave is fed into two micro resonators through a single frequency laser. One of the microresonators is used to generate an optical parametric oscillator, converting the input wave into two output waves of different frequencies. The frequency interval of the new wave is modified to adapt to the terahertz range, and the noise generated by the oscillator can be thousands of times lower than the input laser wave.

This will generate a second microresonator, transforming the optical frequency comb into one of four frequency combs with microwave spacing; Once completed, the optical pulse from the oscillator is fed into the comb generator to synchronize the microwave comb frequency with the terahertz oscillator, synchronizing the two bits and maintaining the optical frequency refractive index.

The research conducted by the Gaeta team demonstrated a simple optical frequency division method that can be carried in small, sturdy, and lightweight boxes. This breakthrough opens up the possibility of chip level technology, which can generate pure and reliable microwave signals similar to those in precision measurement laboratories.

According to his statement, the use of all-optical frequency division can improve the accuracy of microwave radar in autonomous vehicle.
The main idea of this project was proposed by graduate and postdoctoral students Gaeta, Zhao Yun, and Yoshitomo Okawachi. Zhao and Jae Jang subsequently studied these devices and conducted experiments.

This project was developed in close collaboration with Michal Lipson and his team, as well as Cornell University professors Eugene Higgins and Michal Lipson, who were also involved in the construction of photonic chips.

Source: Laser Net

İlgili öneriler
  • Application of Laser Welding Technology in Ceramic Substrate Industry

     Ultra short laser pulses for local welding (Source: Fraunhofer IOF)With the accelerated evolution of electronic devices towards high power, high frequency, and miniaturization, ceramic substrates have become core materials in fields such as power semiconductors, 5G communications, and new energy vehicles due to their excellent thermal conductivity, insulation, and high temperature resistance. H...

    03-17
    Çeviriyi gör
  • Swiitol Launches E24 Pro: A Breakthrough in Laser Engraving Technology

    In order to completely change the world of laser engraving, Swiitol has launched the E24 Pro, a 24W integrated laser engraving machine with cutting-edge features and functions. The Swiitol E24 Pro showcases an innovative integrated structure laser engraving machine made of durable aluminum alloy. It is worth noting that the device can be used out of the box without installation, providing users wi...

    2023-11-23
    Çeviriyi gör
  • Advancing Astronomy: Using Laser Guided Star Adaptive Optics to Obtain clearer celestial views

    Adaptive optics is defined as an advanced optical system used to correct the transmission medium between the subject and the image, providing users with clearer images. Adaptive optics helps to use a complex combination of deformable mirrors to correct images in real-time through distortion in the Earth's atmosphere. These images are of greater importance in many vertical industries such as health...

    2024-02-22
    Çeviriyi gör
  • Goethe, University of Central Florida research team showcases light and thin achromatic diffractive liquid crystal optical systems

    Headdisplay devices such as Apple Vision Pro, Meta Quest, and PICO are expected to completely change the way we perceive and interact with various digital information. By providing more direct interaction with digital information, MR has become one of the key driving forces for the metaverse, spatial computing, and digital twins, and has begun to be widely applied in fields such as intelligent tou...

    2023-09-26
    Çeviriyi gör
  • In the development of modern electronic welding technology, the application advantages of laser soldering process

    With the rapid development of modern electronic information technology, integrated circuit chip packaging forms are also emerging in an endless stream, and the package density is getting higher and higher, which greatly promotes the development of electronic products to multi-function, high performance, high reliability and low cost.So far, through hole technology (THT) and surface mount technolog...

    2023-09-13
    Çeviriyi gör