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Sivers Optics, a subsidiary of Sivers Semiconductors, has signed a product development agreement with an undisclosed company.Starting from the initial contract worth $1.3 million, the prototype will be delivered in 2024, and it is expected that the agreement will grow rapidly in 2025 before transitioning to mass production. After entering full production, customers expect the annual chip productio...
Laser is considered a sharp sword that cuts iron like mud, but even sharper swords can have tricky moments. For example, in certain scenarios, there are materials with higher reflectivity, such as silver, copper, etc., known as "high reflection materials". High reflective materials have a low absorption rate for lasers, making them difficult to process and potentially causing equipment failure or ...
Modern computer chips can construct nanoscale structures. So far, only these tiny structures can be formed on top of silicon chips, but now a new technology can create nanoscale structures in a layer beneath the surface. The inventor of this method stated that it has broad application prospects in the fields of photonics and electronics, and one day, people can manufacture 3D structures on the ent...
The UWBGS program will develop and optimize ultra wide bandgap materials and manufacturing processes for the next revolution in the semiconductor electronics field.US military researchers need to develop new integrated circuit substrates, device layers, junctions, and low resistance electrical contacts for the new generation of ultra wide bandgap semiconductors. They found a solution from RTX comp...
The project of the National Natural Science Foundation of China (Jilin Province) "Multicolor Transparent Silicate Garnet Fluorescent Ceramics for Laser Lighting" presided over by Zhang Jiahua, a researcher in the State Key Laboratory of Luminescence and Applications of Changchun Institute of Optics and Fine Mechanics, has made breakthrough progress, developed green fluorescent transparent ceramics...