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Recently, Dong Yibo, from the Photonic Chip Research Institute of Shanghai University of Technology, published his research findings titled "Nanoprinted Diffractive Layer Integrated Vertical Cavity Surface Emitting Vortex Lasers with Scalable Topological Charge" as the first author in the internationally renowned journal Nano Letters.This achievement was jointly completed by the team of academicia...
The UWBGS program will develop and optimize ultra wide bandgap materials and manufacturing processes for the next revolution in the semiconductor electronics field.US military researchers need to develop new integrated circuit substrates, device layers, junctions, and low resistance electrical contacts for the new generation of ultra wide bandgap semiconductors. They found a solution from RTX comp...
Recently, scientists from the Hanover Laser Center (LZH) in Germany announced the successful development of an automated laser drilling process that can promote the processing of carbon fiber reinforced plastics (CFRP). They stated that this is particularly valuable in applications such as lightweight structures and sound insulation.Composite materials such as carbon fiber reinforced plastics (CFR...
Recently, the research team of the State Key Laboratory of High-Field Laser Physics at the Shanghai Institute of Optics and Fine Mechanics of the Chinese Academy of Sciences has made progress in using high-field lasers to drive the even harmonic frequency shift of single-layer MoS2. The results were published in Optics Express under the title "Frequency shift of even-order high harmonic generation...
Tool has started pre-sales for the F1 Ultra, a 20 watt fiber and diode dual laser engraving machine. OEMs have stated that it is a win-win product and its so-called "flagship" model.Fiber lasers are mainly used for metal materials and usually work faster than diode lasers, but other materials have better performance when using diode lasers. F1 Ultra aims to bridge this gap by using a power of 20W ...