- Нет данных
Русский
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
Recently, optical semiconductor developer Lumiotive, headquartered in Seattle, USA, launched a new LiDAR sensor LM10, which is its first fully produced product of light controlled metasurface (LCM) technology designed for digital beam steering.The developers stated that compared to mechanical systems, their digital beam steering method overcomes the limitations of traditional LiDAR sensors in term...
Recently, Associate Professor Li Jiawen's research group at the Micro and Nano Engineering Laboratory of the School of Engineering Science, University of Science and Technology of China proposed a femtosecond laser dynamic holographic processing method suitable for efficient construction of three-dimensional capillary scaffolds, which is used to generate a three-dimensional capillary network. This...
As is well known, food and beverage product manufacturers have strict requirements in ensuring the hygiene and cleanliness of their equipment. Once these devices and components are designed or manufactured improperly, they are likely to cause pollution, ultimately leading to health hazards, brand reputation damage, and expensive recall actions. The shortage of labor and raw materials further exace...
Rutronik has expanded its optoelectronic product portfolio by introducing green and blue laser diodes packaged in metal cans TO38 and TO56 using AM OSRAM. They leave a deep impression with improved beam quality and stricter electro-optic tolerances. The power level of the laser diode ranges from 10mW to 100mW. Diodes such as PLT3 520FB and PLT5 450GB are now available on the market.The flexibility...
The researchers estimate the period from 2023 to 2028. EUV lithography will address the limitations of traditional optical lithography, which has reached its physical limits in terms of resolution. The shorter wavelength of EUV light allows for the creation of smaller features and tighter patterns on silicon wafers, enabling the manufacture of advanced microchips with greater transistor densities....