E&R Engineering launches a mold cutting solution at Semicon SEA 2024

Advanced laser and plasma solution provider E&R Engineering Corp. has confirmed that they will participate in the Semiconductor SEA 2024 event held in Kuala Lumpur, Malaysia. With 30 years of focus in the semiconductor industry, E&R has developed a wide range of plasma and laser technologies. At Semicon SEA 2024, they will showcase their latest solutions, including:

Plasma Cutting - Small Mold Cutting Solution
E&R provides a hybrid solution that combines laser slotting and plasma cutting, allowing dice channels to be controlled between 10um and 30um. In addition to equipment manufacturing, E&R also provides one-stop cutting services (outsourcing services), processing wafers into small chips of various shapes, hexagons, circles, or MPR patterns.

Advanced packaging:
With extensive expertise in independently developed optical modules and advanced laser system integration, E&R provides laser drilling solutions for 2.5D/3D packaging, with an accuracy of up to+/-5um, with a B/T ratio of 85-90%. In addition, E&R is also known for its precision laser marking technology, which integrates a 4-beam marking solution to achieve high throughput while maintaining+/-25um accuracy. The thermal impact control of the laser cutting process is excellent, as well as a high uniformity (CPK>1.33) plasma solution.

Glass substrate solution:
E&R is one of the leading equipment manufacturers supporting glass substrate processes. In addition to achieving a high productivity TGV solution of 600-1000 VPS while maintaining accuracy of 5 um-3 sigma, E&R also provides advanced solutions for glass laser polishing to improve the roughness of glass sidewalls, laser beveling, and AOI technology.

Silicon carbide solution:
E&R offers a range of solutions, including shallow laser annealing after ion implantation to activate ions and restore lattice, SiC wafer ID labeling, and plasma cleaning. In addition, E&R has also launched Raman testing machines to detect cracks, defects, and internal stresses, effectively improving process yield.

FOPLP - for fanout panel level packaging of 700 * 700mm
E&R has developed a full range of machines that support the processing of large panel sizes up to 700 * 700mm, including laser marking, cutting, plasma cleaning, and decontamination after drilling. The warping processing ability is excellent, reaching 16mm while maintaining high throughput capacity.

Source: Laser Net