Português

Three core processes of laser soldering support the development of PCB electronics industry

876
2024-04-15 16:43:52
Ver tradução

In the field of modern electronic manufacturing, PCB (printed circuit board) serves as the carrier of electronic components. In its manufacturing process, laser soldering technology has become a key link in PCB electronic manufacturing due to its advantages of high precision, high efficiency, and low thermal impact. This article will explore the application of laser soldering technology and its main soldering materials - tin wire, solder paste, and solder balls - in PCB electronic manufacturing.

01
Laser Tin Wire Welding for PCB Circuit Board Welding
Tin wire plays an important role in laser soldering process. After focusing the laser beam, it can quickly melt the tin wire, achieving reliable connection between components and PCB boards. This welding method not only reduces the thermal stress generated during the welding process, but also effectively improves the welding quality and reduces the welding defect rate.
Laser tin wire welding has the advantages of high precision and high efficiency, and is suitable for situations with high requirements for welding quality. By adjusting the laser power and focal length, precise welding of PCB boards with different materials and thicknesses can be achieved.

02
Laser solder paste welding for PCB circuit board welding
Solder paste is mainly used for soldering surface mount components. After coating an appropriate amount of solder paste on the PCB board, the components are heated by a laser soldering machine to melt the solder paste and penetrate into the gap between the components and the PCB board, forming a solid solder joint.
Solder paste welding has the characteristics of simple operation and fast welding speed, making it suitable for efficient welding on large-scale production lines. In addition, solder paste welding can also reduce production costs and improve welding quality.

03
Laser solder ball welding for PCB circuit board welding
Tin balls, as a new type of soldering material, have received widespread attention in the field of laser soldering in recent years. The laser beam quickly melts the solder balls and accurately drips them onto the solder joints, achieving the welding between the components and the PCB board.
Tin ball welding has the advantages of high welding accuracy and low heat impact, making it particularly suitable for high-end electronic products that require high welding quality, such as BGA chips, wafers, hard disk heads, camera modules, and optoelectronic products.

04
The Future Development of Laser Soldering Technology
In the field of PCB electronic manufacturing, the emergence of laser soldering technology, combined with perfect soldering materials such as tin wire, solder paste, and solder balls, has brought revolutionary changes to the entire electronics industry and injected a continuous stream of vitality. In the future, with the continuous development of technology, we believe that laser soldering technology will play a more important role in the electronics industry, bringing more convenience and surprises to our lives.

05
The advantages of laser soldering technology
The perfect combination of laser soldering technology and various soldering materials further improves the welding quality. Not only has it subverted traditional soldering methods, but it has also significantly reduced production costs and defect rates while improving welding efficiency and quality, laying a solid foundation for the sustainable development of the electronic manufacturing industry.

Soldering materials such as tin wire, solder paste, and solder balls, under the action of laser, can not only quickly melt and achieve perfect fusion with the parts to be welded, ensuring the strength and stability of the welded joint, but also avoiding adverse phenomena such as virtual soldering and cold soldering that may occur in traditional soldering. The high-speed characteristics of laser welding significantly improve production efficiency, providing strong support for the large-scale production of electronic products.

In addition, laser soldering technology also has high flexibility. By adjusting the laser power and focal length, precise welding of PCB boards with different materials and thicknesses can be achieved. This flexibility makes laser soldering technology more widely used in the field of PCB electronics, meeting the needs of different customers.

Source: Zichen Laser

Recomendações relacionadas
  • Brother launches a series of color LED laser printers for homes and offices

    Brother is an innovative global company that proudly launches its latest series of color LED laser printers. The new printer series is colorful and seamlessly connected, designed specifically for home and small office environments.The company's latest product aims to improve productivity in home and small business environments, combining excellent printing quality with excellent printing speed. Ea...

    2024-03-20
    Ver tradução
  • Snapmaker introduces new 20W and 40W laser modules

    Snapmaker has opened pre-orders for 20W and 40W laser modules, which are significant upgrades to the modules available on existing Snapmaker machines.Snapmaker says that with the 40W module installed, you will be able to cut 15 mm basswood plywood at a time at a speed of 20 mm/SEC. With 20W, you will cut 10mm at a rate of 10mm/SEC. That's a lot more than Artisan and Snapmaker 2.0 - both are comp...

    2023-08-04
    Ver tradução
  • STMicroelectronics and Metalenz collaborate to promote the popularization of metasurface optical devices

    STMicroelectronics (ST), a developer of semiconductor technologies and Metalenz, which creates metasurface optics, have announced a new license agreement.The companies intend to broaden ST’s capability to use Metalenz IP to produce advanced metasurface optics based on ST’s manufacturing platform combining 300mm semiconductor and optics production, test and qualification. (Any) fiancial details of ...

    07-18
    Ver tradução
  • The acoustooptic modulation of gigawatt level laser pulses in ambient air can be applied to other optical components such as lenses and waveguides

    An interdisciplinary research group, including the German synchrotron radiation accelerator DESY and the Helmholtz Institute in Jena, Germany, reported that invisible gratings made of air not only are not damaged by lasers, but also maintain the original quality of the beam.The relevant research has been published in Nature Photonics under the title of "Acousto opt modulation of gigawatt scale las...

    2023-10-12
    Ver tradução
  • Scientists have successfully miniaturized erbium-based erbium lasers on silicon nitride photonic chips

    Scientists from the Federal Institute of Technology in Lausanne (EPFL) have successfully miniaturized a powerful erbium-based erbium laser on silicon nitride photonic chips. Due to the large volume and difficulty in shrinking of typical erbium-based fiber lasers, this breakthrough is expected to make significant progress in optical communication and sensing technology.Since the 1960s, lasers have ...

    2024-06-13
    Ver tradução