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Additive manufacturing (AM) has made it possible to manufacture complex personalized items with minimal material waste, leading to significant changes in the manufacturing industry. However, optimizing and improving additive manufacturing processes remains challenging due to the complexity of design, material selection, and process parameters. This review explores the integration of artificial int...
According to a report in Nature on June 26th, a team from Stanford University in the United States has developed a titanium sapphire laser on a chip. Whether in terms of scale efficiency or cost, this achievement is a huge progress. Image source: Nature websiteTitanium sapphire lasers are indispensable in many fields such as cutting-edge quantum optics, spectroscopy, and neuroscience, but they ...
The manufacturing of sensors through 3D printing combines speed, design freedom, and the possibility of using waste as a substrate. In the circular economy model, various results have been achieved, and typically discarded residues are used as low-cost resources. A research team in Brazil has proposed a highly creative solution that involves printing electrochemical sensors on fallen leaves. The t...
Researchers at the University of Sydney combined photon filters and modulators on a single chip, enabling them to accurately detect signals on the broadband RF spectrum. This work brings photonic chips closer to one day, potentially replacing larger and more complex electronic RF chips in fiber optic networks.The Sydney team utilized stimulated Brillouin scattering technology, which involves conve...
The UWBGS program will develop and optimize ultra wide bandgap materials and manufacturing processes for the next revolution in the semiconductor electronics field.US military researchers need to develop new integrated circuit substrates, device layers, junctions, and low resistance electrical contacts for the new generation of ultra wide bandgap semiconductors. They found a solution from RTX comp...