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Recently, Gaota Semiconductor announced the successful development of an advanced 3D imager based on dToF technology for LiDAR applications. The newly developed product FL6031 is based on Tower's 65nm Stacked BSI CIS platform and has pixel level hybrid bonding function. It is the first in a series of products aimed at meeting the needs of numerous deep sensing applications in the automotive, consu...
Laudado&Associates LLC (L&A), an agricultural technology development company headquartered in California, announced the Autonomous Agricultural Solutions Conference held at FIRA Robotics&last week in Salinas, California.This patent pending technology is a completely new design, designed by L&A, aimed at maximizing the commercial feasibility of laser weeding and thinning. It utilize...
The team from the Photonic Systems Laboratory at the Federal Institute of Technology in Lausanne has developed a chip level laser source that can improve the performance of semiconductor lasers while generating shorter wavelengths.This groundbreaking work, led by Professor Camille Br è s and postdoctoral researcher Marco Clementi from the Federal Institute of Technology in Lausanne, represe...
In the fields of optics and micro/nano processing, precise manipulation of lasers to meet the growing demand for miniaturization is an important challenge in driving the development of modern electronic and biomedical equipment. Recently, researchers from Tohoku University in Japan successfully demonstrated the use of interference technology to enhance the longitudinal electric field of radially p...
By using a new type of laser, the processing speed of wafers can be 10 to 20 times faster than before. This is the result of a research project at the Fraunhofer Institute for Solar Systems in Germany.Researchers have developed a prototype that can use ultraviolet waves to carve the most intricate structures on silicon wafers. The new system concept enables solar cell manufacturers to perform lase...