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Chip giant Intel announced that it has completed the assembly work of the world's first commercial high numerical aperture (NA) extreme ultraviolet lithography (EUV) scanner. This device greatly improves the resolution and feature scaling of next-generation chips by changing the optical design used to project printed images onto silicon wafers.This lithography equipment weighing 150 tons has been ...
Recently, the discussion on "miniaturization" in the domestic laser industry has become increasingly heated. From various exhibition venues, miniaturization and lightweight have become important display directions for fiber laser manufacturers.High energy and miniaturization have become new trendsIn the past few years, high-power has undoubtedly been the main development direction in the field of ...
Chip level ultrafast mode-locked laser based on nanophotonic lithium niobate.Researchers have created a compact mode-locked laser integrated into a nanophotonic platform, capable of generating high-power and ultrafast optical pulses. The breakthrough in miniaturization of MLL technology can significantly expand the application of photonics.Innovation in mode-locked laser technologyTo improve the t...
Recently, American semiconductor equipment manufacturer MKS Instruments announced plans to build a factory in Penang, Malaysia to support the production of wafer manufacturing equipment in the region and globally. This development plan will be divided into three stages to build a new factory, and it is expected to break ground and start construction in early 2025.Why choose to build a factory in M...
In October 2023, Germany's AMCM (EOS, a global technology leader in industrial grade additive manufacturing) announced the upcoming launch of the M 8K metal 3D printing equipment. The device will be equipped with 8 lasers, with a construction volume of 800 x 800 x 1200 millimeters, nearly four times the size of AMCM's previously launched M 4K metal 3D printing device on the market.ArianeGroup's ho...