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TRUMPF introduced its TruMatic 5000 manufacturing unit and new SheetMaster automatic loading and unloading device technology at the 2023 Blechexpo Metal Plate Processing Exhibition in Stuttgart, Germany.Users of the new system will benefit from fully automatic laser cutting, punching, and forming capabilities. The new SheetMaster device can achieve fully automated material flow within the manufact...
The UWBGS program will develop and optimize ultra wide bandgap materials and manufacturing processes for the next revolution in the semiconductor electronics field.US military researchers need to develop new integrated circuit substrates, device layers, junctions, and low resistance electrical contacts for the new generation of ultra wide bandgap semiconductors. They found a solution from RTX comp...
Recently, American semiconductor equipment manufacturer MKS Instruments announced plans to build a factory in Penang, Malaysia to support the production of wafer manufacturing equipment in the region and globally. This development plan will be divided into three stages to build a new factory, and it is expected to break ground and start construction in early 2025.Why choose to build a factory in M...
When running various artificial intelligence programs such as large language models, although data centers and high-performance computers are not limited by the computing power of their individual nodes, the amount of data transmitted between nodes is currently the root cause of the limitations on the performance and bandwidth transmission of these systems.Because some nodes in the system are more...
In today's technology field, Juguang Technology released two highly anticipated high-power semiconductor lasers on December 13th: GS09 and GA03. These two products are leading the innovation wave in the laser industry with their miniaturized design, excellent thermal management capabilities, and extensive customization flexibility.GS09 revolutionizes chip spacing by compressing the width of the st...