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How can EMAG Laser Technology accelerate the production of critical powertrain components using its flagship product ELC 6 system?The rapid popularity of electric vehicles worldwide indicates that production planners must increase their efforts in producing key components of electric vehicles, particularly the rotor shaft. The importance of the rotor shaft as the core component for converting elec...
In the long history of technological development, every major breakthrough in technology is like a shining star, illuminating the path forward for humanity. At the Photonics West conference in 2025, numerous breakthroughs in cutting-edge photonics technologies attracted the attention of the global academic and industrial communities. Several important technological advancements reported in this ex...
At the UpakExpo 2024 exhibition to be held in Moscow at the end of January, Chinese company Golden Laser will showcase for the first time two laser die-cutting machines focused on the printing, labeling, and packaging markets in Russia.The Golden Laser LC350 is a web machine designed to handle labels printed on digital and flexographic printing machines. It can cut, die cut, and kiss cut paper, pl...
Recently, several large trucks from the Wenzhou factory of Pentium Laser were lined up and ready to go. The high-power and high-speed laser cutting automation production line developed and produced by Pentium Laser has been strictly inspected and accepted by Japanese customers for 15 days and 24 hours of uninterrupted operation. Today, it was loaded and sent to Japan. This laser cutting automati...
近日,从江苏通用半导体有限公司传来消息,由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司,并投入生产。 图:8英寸SiC晶锭激光全自动剥离设备 该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片,包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集,一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白,突破了国外的技术封锁,将极大地提升我国碳化硅芯片产业的自主化、产业化水平。 该设备年可剥离碳化硅衬底20000片,实现良率95%以上,与传统的线切割工艺相比,大幅降低了产品损耗,而设备售价仅仅是国外同类产品的1/3。 近年来,碳化硅功率器件在大功率半导体市场中所占的份额不断提高,并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...