BOFA launches the latest generation of high-temperature 3D printing filtration technology

According to a report from Maims Consulting, scientists at the University of St. Andrews in the UK recently stated that they have made a "significant breakthrough" in the decades of challenges in developing compact organic semiconductor laser technology.Firstly, an OLED with a world record light output was manufactured, and then integrated with a polymer laser structure. This new type of las...

High brightness semiconductor lasers have extremely important applications in fields such as laser radar. Traditional semiconductor lasers face challenges such as large vertical divergence angle, elliptical beam output, multiple lateral modes, and poor beam quality, which limit the direct application of high brightness semiconductor lasers.In response to this challenge, the team from the Bimberg S...

Recently, researchers have developed a comb laser with higher stability and efficiency. The use of synthetic reflection self injection locking micro comb design enables the laser to achieve stability and increase conversion efficiency by more than 15 times. This efficient, stable, and easy to manufacture design is expected to make rapid progress in fields such as portable sensors, autonomous navig...

Recently, the team led by Wu Kaifeng, a researcher at the Dalian Institute of Chemical Physics, Chinese Academy of Sciences, and Zhu Jingyi, an associate researcher, has made progress in the interdisciplinary field of photochemistry and photophysics. The team directly observed the quantum coherence properties of hybrid free radical pairs composed of quantum dots and organic molecules, achieving ef...

Recently, EO Technologies, a well-known semiconductor laser processing equipment manufacturer in South Korea, is emerging in the glass substrate processing market.It is understood that EO Technologies is entering the glass substrate TGV market based on its UV laser drilling equipment originally used in PCB substrate technology. TGV technology is the core process for drilling holes inside glass sub...