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Recently, Gaota Semiconductor announced the successful development of an advanced 3D imager based on dToF technology for LiDAR applications. The newly developed product FL6031 is based on Tower's 65nm Stacked BSI CIS platform and has pixel level hybrid bonding function. It is the first in a series of products aimed at meeting the needs of numerous deep sensing applications in the automotive, consu...
Researchers at the University of Illinois at Urbana Champaign have developed compact visible wavelength achromatic mirrors using 3D printing and porous silicon, which are crucial for miniaturization and lightweight optical devices. These high-performance hybrid micro optical devices can achieve high focusing efficiency while minimizing volume and thickness. In addition, these microlenses c...
It is reported that researchers from BIAS Bremer Institution f ü r angewandte Strahltechnik GmbH in Germany have reported a comparative study of laser deep penetration welding processes for pure nickel using blue and infrared light wavelengths. The related research was published in Welding in the World under the title "Process comparison of laser deep penetration welding in pure nickel using blue ...
A team of researchers at the Fraunhofer Institute for Optoelectronics, Systems Technology and Image Development and Karlsruhe Institute of Technology are using single-photon avalanche diode (SPAD) arrays to achieve three-dimensional (3D) quantum ghost imaging.The new method, called "asynchronous detection," produces the lowest photon dose of any measurement and can be used to image light-sensitive...
Figure: Experimental setup.Quantum memory that relies on quantum band integration is a key component in developing quantum networks that are compatible with fiber optic communication infrastructure. Quantum engineers and information technology experts have yet to create such a high-capacity network that can form integrated multimode photonic quantum memories in communication frequency ban...