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According to South Korean media etnews, Samsung Electronics and SK Hynix have started the process technology conversion of high bandwidth memory (HBM) wafers, with the introduction of new technologies to prevent wafer warping as the core, which is considered to be aimed at the next generation HBM. It is expected that with the process transformation, the material and equipment supply chain will als...
Semiconductor laser pump sources, especially those with a wavelength of 969nm, have become the preferred choice for high-power/high peak energy disc lasers due to their reduced quantum losses and heat generation.The 3000W 969nm fiber coupled semiconductor laser system launched by BWT uses 800 μ m NA0.22 fiber to output flat top optical energy distribution, combining lightweight and excellent optic...
Recently, Laser Components USA, a leading laser and optoelectronic component supplier, announced that it has reached a strategic distribution agreement with Infrasolid, a pioneer in advanced infrared emitter technology.This agreement combines Laser Components USA's extensive distribution network with Infrasolid's innovative infrared product solutions, providing direct replacement products for all ...
Scientists from Leibniz University in Hanover have pioneered the development of a new manufacturing technology - UV LED based microscopy projection lithography. This technology is expected to completely change the manufacturing method of optical components, providing high resolution at lower cost and ease of use. The MPP system utilizes the power of UV LED light sources to transcribe the structura...
Recently, Laser Photonics Corporation (LPC), a laser cleaning equipment developer listed on NASDAQ in the United States, announced that the company has signed a final agreement to acquire Control Micro Systems, Inc. (CMS) through an Asset Purchase Agreement (APA), but the financial details of the transaction have not yet been disclosed.At present, LPC's market value has shrunk by 70%, and it is de...