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With the rapid development of modern electronic information technology, integrated circuit chip packaging forms are also emerging in an endless stream, and the package density is getting higher and higher, which greatly promotes the development of electronic products to multi-function, high performance, high reliability and low cost.So far, through hole technology (THT) and surface mount technolog...
Cambridge Vacuum Engineering (CVE), a precision welding equipment company in the UK, and Cranfield University recently announced that they have successfully reached a Knowledge Transfer Partnership (KTP), which will provide global engineers with more welding options.In this cooperation, both parties jointly solved the optical pollution problem in vacuum laser welding, paving the way for the compre...
Recently, teachers and students from the Institute of Solid State Laser and Ultrafast Photonics at the School of Physics and Optoelectronic Engineering have made significant progress in the study of ultrafast carrier dynamics in optoelectronic functional crystals. The related research results are titled "Anisotropic carrier dynamics and laser fabricated luminosity patterns on oriented single cryst...
The US Department of Energy recently allocated $42 million to support the development of laser fusion technology and designated three new research and innovation centers. This strategic investment aims to promote laser based nuclear fusion to play an important role as a clean and sustainable energy source in the future. Trumpf is one of the main participants known for its laser expertise and activ...
Recently, a research team from the University of Massachusetts Amherst has pioneered a new technology that uses laser irradiation on concentric superlenses on chips to generate holograms, thereby achieving precise alignment of 3D semiconductor chips.This research result, published in the journal Nature Communications, is expected to not only reduce the production cost of 2D semiconductor chips, bu...