- Δεν υπάρχουν δεδομένα
Ελληνικά
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
Panacol will showcase new optical grade resins and adhesives for embossing and optical bonding applications at the SPIE Photonics West exhibition held in San Francisco, California, USA from January 30 to February 1, 2024.These new adhesives can be used for sensors in lightweight carpets, smart devices, and wearable devices in the automotive industry, or for generating structured light in projector...
Superlenses are nano artificial structures that can manipulate light, providing a technique that can significantly reduce the size and thickness of traditional optical components. This technology is particularly effective in the near infrared region, and has great prospects in various applications, such as LiDAR, which is called "the eye of autonomous vehicle", mini UAV and blood vessel detector.D...
According to the latest news, on June 3, 2024, Coherent Corp. appointed Jim Anderson as CEO and he will also become a member of the board, replacing Vincent "Chuck" Mattera.Image source: CoherentAnderson (left) Mattera (right)Dr. Vincent "Chuck" D. Mattera, Jr. previously notified the Coherent Board of Directors on February 20, 2024, stating that he would resign from the position of CEO upon his ...
For centuries, people have known that light exhibits wave like behavior in certain situations. When light passes through certain materials, they can change the polarization of light waves (i.e. the direction of oscillation). The core components of optical communication networks, such as optical isolators or photodiodes, utilize this characteristic. This type of component allows light to propagate ...
近日,从江苏通用半导体有限公司传来消息,由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司,并投入生产。 图:8英寸SiC晶锭激光全自动剥离设备 该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片,包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集,一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白,突破了国外的技术封锁,将极大地提升我国碳化硅芯片产业的自主化、产业化水平。 该设备年可剥离碳化硅衬底20000片,实现良率95%以上,与传统的线切割工艺相比,大幅降低了产品损耗,而设备售价仅仅是国外同类产品的1/3。 近年来,碳化硅功率器件在大功率半导体市场中所占的份额不断提高,并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...