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By using a new type of laser, the processing speed of wafers can be 10 to 20 times faster than before. This is the result of a research project at the Fraunhofer Institute for Solar Systems in Germany.Researchers have developed a prototype that can use ultraviolet waves to carve the most intricate structures on silicon wafers. The new system concept enables solar cell manufacturers to perform lase...
Ditzingen, 05. March 2025 – At its in-house exhibition INTECH, high-tech company TRUMPF is showcasing a new cooler for its laser cutting machines. The new unit is capable of reducing energy consumed during the cooling process and uses fifty percent less energy than conventional solutions. Unlike conventional coolers, the main components of this new solution— such as pumps, fans and compressors— ar...
In November 2024, based on the mutual trust and cooperation over the past years, the Munich Shanghai Optical Expo and the Light Academic Publishing Center of the Changchun Institute of Optics, Precision Mechanics and Physics, Chinese Academy of Sciences (hereinafter referred to as the "Light Center") reached a consensus on further strategic development as they ushered in the year of disruptive sci...
Recently, a new laser heating technology developed by a Japanese research group has paved the way for advanced optical communication equipment by integrating transparent magnetic materials into optical circuits.This breakthrough was recently published in the journal Optical Materials. It is crucial for integrating magneto-optical materials and optical circuits, which has been a significant long-te...
Topological laser (TL) is an ideal light source for future new optoelectronic integrated chips, designed and manufactured using topological optics principles to obtain robust single-mode lasers. Electrically pumped topology lasers have become a research hotspot due to their small size and ease of integration, but topology lasers based on electrical injection are still in the early stages of resear...