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Topological laser (TL) is an ideal light source for future new optoelectronic integrated chips, designed and manufactured using topological optics principles to obtain robust single-mode lasers. Electrically pumped topology lasers have become a research hotspot due to their small size and ease of integration, but topology lasers based on electrical injection are still in the early stages of resear...
Researchers from Columbia University in New York reported the latest research on reverse laser sintering of metal powders. The related achievements were published in Scientific Reports under the title "Invested laser sintering of metal powder".The researchers demonstrated the ability of reverse laser sintering technology to manufacture metal powder parts. Researchers first deposit a layer of coppe...
Recently, DIT, a well-known semiconductor and display equipment manufacturer in South Korea, announced that the company has signed an agreement worth 20.52 billion Korean won to supply wafer processing equipment to SK Hynix. After the announcement, DIT's stock price rose for five consecutive days, entering the 16000 Korean won range. Then on the 22nd, it rose 2580 Korean won from the previous day'...
近日,从江苏通用半导体有限公司传来消息,由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司,并投入生产。 图:8英寸SiC晶锭激光全自动剥离设备 该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片,包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集,一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白,突破了国外的技术封锁,将极大地提升我国碳化硅芯片产业的自主化、产业化水平。 该设备年可剥离碳化硅衬底20000片,实现良率95%以上,与传统的线切割工艺相比,大幅降低了产品损耗,而设备售价仅仅是国外同类产品的1/3。 近年来,碳化硅功率器件在大功率半导体市场中所占的份额不断提高,并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...
On August 6th local time, Luminar, a leading publicly traded company in the field of LiDAR, announced a $422 million debt restructuring and raised $100 million in new capital. This measure marks Luminar taking solid steps in optimizing its capital structure and enhancing its financial stability.In early May this year, this laser radar manufacturer released an open letter disclosing a major strateg...