繁体中文

Three core processes of laser soldering support the development of PCB electronics industry

514
2024-04-15 16:43:52
查看翻譯

In the field of modern electronic manufacturing, PCB (printed circuit board) serves as the carrier of electronic components. In its manufacturing process, laser soldering technology has become a key link in PCB electronic manufacturing due to its advantages of high precision, high efficiency, and low thermal impact. This article will explore the application of laser soldering technology and its main soldering materials - tin wire, solder paste, and solder balls - in PCB electronic manufacturing.

01
Laser Tin Wire Welding for PCB Circuit Board Welding
Tin wire plays an important role in laser soldering process. After focusing the laser beam, it can quickly melt the tin wire, achieving reliable connection between components and PCB boards. This welding method not only reduces the thermal stress generated during the welding process, but also effectively improves the welding quality and reduces the welding defect rate.
Laser tin wire welding has the advantages of high precision and high efficiency, and is suitable for situations with high requirements for welding quality. By adjusting the laser power and focal length, precise welding of PCB boards with different materials and thicknesses can be achieved.

02
Laser solder paste welding for PCB circuit board welding
Solder paste is mainly used for soldering surface mount components. After coating an appropriate amount of solder paste on the PCB board, the components are heated by a laser soldering machine to melt the solder paste and penetrate into the gap between the components and the PCB board, forming a solid solder joint.
Solder paste welding has the characteristics of simple operation and fast welding speed, making it suitable for efficient welding on large-scale production lines. In addition, solder paste welding can also reduce production costs and improve welding quality.

03
Laser solder ball welding for PCB circuit board welding
Tin balls, as a new type of soldering material, have received widespread attention in the field of laser soldering in recent years. The laser beam quickly melts the solder balls and accurately drips them onto the solder joints, achieving the welding between the components and the PCB board.
Tin ball welding has the advantages of high welding accuracy and low heat impact, making it particularly suitable for high-end electronic products that require high welding quality, such as BGA chips, wafers, hard disk heads, camera modules, and optoelectronic products.

04
The Future Development of Laser Soldering Technology
In the field of PCB electronic manufacturing, the emergence of laser soldering technology, combined with perfect soldering materials such as tin wire, solder paste, and solder balls, has brought revolutionary changes to the entire electronics industry and injected a continuous stream of vitality. In the future, with the continuous development of technology, we believe that laser soldering technology will play a more important role in the electronics industry, bringing more convenience and surprises to our lives.

05
The advantages of laser soldering technology
The perfect combination of laser soldering technology and various soldering materials further improves the welding quality. Not only has it subverted traditional soldering methods, but it has also significantly reduced production costs and defect rates while improving welding efficiency and quality, laying a solid foundation for the sustainable development of the electronic manufacturing industry.

Soldering materials such as tin wire, solder paste, and solder balls, under the action of laser, can not only quickly melt and achieve perfect fusion with the parts to be welded, ensuring the strength and stability of the welded joint, but also avoiding adverse phenomena such as virtual soldering and cold soldering that may occur in traditional soldering. The high-speed characteristics of laser welding significantly improve production efficiency, providing strong support for the large-scale production of electronic products.

In addition, laser soldering technology also has high flexibility. By adjusting the laser power and focal length, precise welding of PCB boards with different materials and thicknesses can be achieved. This flexibility makes laser soldering technology more widely used in the field of PCB electronics, meeting the needs of different customers.

Source: Zichen Laser

相關推薦
  • Showcasing the world's fastest photonics alignment system for SiPh chips on Photonics West

    With its proprietary fast multi-channel photon alignment algorithm and professional high-precision machinery, PI helps customers improve production efficiency to participate in the rapidly growing silicon photonics market. Over the past decade, PI has been continuously expanding its range of automatic photon alignment engines and will launch new systems at both ends of the spectrum in this year's ...

    2024-01-19
    查看翻譯
  • Additive Manufacturing Software Market 2025: Analysis, Data, and Forecasting

    In March 2025, Additive Manufacturing Research (AMR) released its latest 3D printing market research report, "AM Software Markets 2025: Analysis, Data, and Forecast," which provides a comprehensive and in-depth analysis of the 3D printing software industry. The latest research findings indicate that global revenue from additive manufacturing (AM) software is expected to grow from $2.44 billion in ...

    03-17
    查看翻譯
  • Romania Center launches the world's most powerful laser

    Are you ready? The signal is out! "In the control room of a research center in Romania, engineer Antonio Toma has activated the world's most powerful laser, which is expected to make revolutionary progress in various fields from the health sector to space. The laser located in the center near the Romanian capital Bucharest is operated by the French company Thales and utilizes the invention of Nobe...

    2024-04-01
    查看翻譯
  • New two-photon aggregation technology significantly reduces the cost of femtosecond laser 3D printing

    Scientists at Purdue University in the United States have developed a new type of two-photon polymerization technology. This technology cleverly combines two lasers and utilizes 3D printing technology to print complex high-resolution 3D structures while reducing femtosecond laser power by 50%. It helps to reduce the cost of high-resolution 3D printing technology, thereby further expanding its appl...

    2024-07-05
    查看翻譯
  • Construction of Advanced New Laser Research Centers in American Universities

    The ATLAS R&D center is expected to be completed by mid-2026!A powerful new laser research facility located on the Foothills campus of Colorado State University will begin construction this month. The facility is planned to be put into use in mid-2026 and is the result of 40 years of laser development research at Colorado State University. It is a collaboration with the Fusion Energy Science P...

    2024-10-30
    查看翻譯