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In the era of the Internet of Things, visual image sensors, as key devices in the intelligent society, are embedded in various devices such as mobile communication terminals, smart wearable devices, automobiles, and industrial machines. With the continuous expansion of applications, higher requirements have been put forward for the system power consumption, response speed, safety performance, and ...
Lawrence Livermore National Laboratory (LLNL) and the Extreme Light Infrastructure (ELI) European Research Infrastructure Consortium (ERIC) have announced that they have signed a new Memorandum of Understanding. This builds on their existing decade of strategic collaboration to advance high-power laser technology.“We are looking forward to expanding our existing collaborations with ELI on areas su...
Recently, Siemens Energy's Materials Solutions division (hereinafter referred to as Siemens) officially signed a cooperation agreement with Rolls Royce, a well-known enterprise in the field of aviation engines in the UK, agreeing that Siemens will develop and supply mass-produced additive manufacturing components for Rolls Royce's civil aerospace business.Rolls Royce and 3D Printing TechnologyRoll...
Recently, Shanghai Jiao Tong University Wuxi Photon Chip Research Institute (CHIPX) located in Binhu District, Wuxi City, has achieved a breakthrough - the first 6-inch thin film lithium niobate photon chip wafer has been produced on China's first photon chip pilot line, and high-performance thin film lithium niobate modulator chips with ultra-low loss and ultra-high bandwidth have been mass-produ...
The UWBGS program will develop and optimize ultra wide bandgap materials and manufacturing processes for the next revolution in the semiconductor electronics field.US military researchers need to develop new integrated circuit substrates, device layers, junctions, and low resistance electrical contacts for the new generation of ultra wide bandgap semiconductors. They found a solution from RTX comp...