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By using a new type of laser, the processing speed of wafers can be 10 to 20 times faster than before. This is the result of a research project at the Fraunhofer Institute for Solar Systems in Germany.Researchers have developed a prototype that can use ultraviolet waves to carve the most intricate structures on silicon wafers. The new system concept enables solar cell manufacturers to perform lase...
Recently, the research team of Chang Lin from the School of Electronics of Peking University and the research team of Li Wangzhe from the Aerospace Information Research Institute of the Chinese Academy of Sciences published a research article entitled "Microcomb synchronized optoelectronics" online in Nature Electronics, realizing the application of photonic chip clocks in information systems for ...
Laser material processing has been widely used in advanced industries, ranging from designing and producing lightweight, ultra wear-resistant parts and equipment with complex geometric shapes to repairing damaged or worn components through technologies such as 3D printing of deposited metal powders or deposits.Use laser pulses for surface treatment to prevent fatigue. But the impact of such techno...
Recently, a joint research team composed of Sun Meizhi, associate researcher of the High Power Laser Physics Joint Laboratory of the Chinese Academy of Sciences Shanghai Institute of Optics and Precision Mechanics, and Tu Xiaoniu, associate researcher of the Chinese Academy of Sciences Shanghai Institute of Silicate, proposed a new configuration of cross Fabry Perot intracavity optical parametric ...
The femtosecond laser emits ultra short optical pulses with a duration of less than one picosecond, reaching the femtosecond level (1fs=10-15s). The characteristics of femtosecond laser are extremely short pulse width and high peak intensity.Ultra short pulse trains can minimize residual heat, ensure precise material processing, and minimize incidental damage. Its high peak intensity can induce no...