- 暂无数据
简体中文
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
Chinese industrial 3D printer manufacturer Huashu High tech has launched the FS811M metal powder bed fusion series platform. The FS811M series has a construction volume of 840 x 840 x 960 millimeters and can be equipped with powerful 6, 8, 10, or 12 x 500 watt fiber lasers."As the latest member of the Huashu High tech Metal 3D printer product portfolio, FS811M originates from our joint innovation ...
Recently, nLIGHT launched a new series of ProcessGUARD fiber lasers, which innovatively integrates process monitoring systems with fiber lasers and is committed to providing quality "protection" for applications such as cutting, welding, and additive manufacturing.New ConceptThe nLIGHT ProcessGUARD series fiber laser integrates a photodiode based plasma process monitoring system into the nLIGHT Co...
High brightness semiconductor lasers have extremely important applications in fields such as laser radar. Traditional semiconductor lasers face challenges such as large vertical divergence angle, elliptical beam output, multiple lateral modes, and poor beam quality, which limit the direct application of high brightness semiconductor lasers.In response to this challenge, the team from the Bimberg S...
When it comes to additive manufacturing, some people may not have heard of it, but when it comes to its other name: 3D printing, no one is unaware.In fact, the name 'additive manufacturing' better illustrates the essence of this processing method. From ancient times to the present, humans have put in great effort to achieve the goal of processing 'raw materials into the shapes we need'. From the S...
Researchers from the Massachusetts Institute of Technology and the University of Texas at Austin showcased the first chip based resin 3D printer. Their concept verification tool consists of a millimeter sized photon chip that emits a programmable beam of light into resin holes, which solidify into a solid structure when exposed to light.The prototype processor does not have mobile components, but ...