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Polish metal 3D printing company Amazemet uses the Xcelerator software combination from industrial manufacturing company Siemens.The spin off company of Warsaw University of Technology is using Siemens workflow management software to develop its metal powder atomizer and 3D printing post-processing equipment.Amazemet was founded in 2016, and its ultrasonic atomization device is capable of producin...
The UWBGS program will develop and optimize ultra wide bandgap materials and manufacturing processes for the next revolution in the semiconductor electronics field.US military researchers need to develop new integrated circuit substrates, device layers, junctions, and low resistance electrical contacts for the new generation of ultra wide bandgap semiconductors. They found a solution from RTX comp...
The new device is a frequency comb - a special type of laser that can generate multiple wavelengths of light, each with a fixed frequency interval. On the spectrogram, it looks a bit like the teeth of a comb. In approximately a quarter century since their first development, these "cursor rulers" have completely transformed various high-precision measurements from timing to molecular detection. In ...
The rapid development of photonic integrated circuits (PICs) has combined multiple optical devices and functions on a single chip, completely changing optical communication and computing systems.For decades, silicon-based PICs have dominated the field due to their cost-effectiveness and integration with existing semiconductor manufacturing technologies, despite their limitations in electro-optic ...
Ultra short laser pulses for local welding (Source: Fraunhofer IOF)With the accelerated evolution of electronic devices towards high power, high frequency, and miniaturization, ceramic substrates have become core materials in fields such as power semiconductors, 5G communications, and new energy vehicles due to their excellent thermal conductivity, insulation, and high temperature resistance. H...