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Dr. Tan Chaolin from the Singapore Institute of Manufacturing Technology, in collaboration with China University of Petroleum, Shanghai Jiao Tong University, Princeton University, University of Malta, Huazhong University of Science and Technology (Professor Zhang Haiou), University of California, Irvine, Hunan University, and EPM Consulting, published an article titled "Review on Field Assisted Me...
Two dimensional transition metal chalcogenides have multi valley structures in their energy bands, giving them electron valley degrees of freedom, making them an ideal platform for studying multi body interactions. As the main mechanism of valley depolarization, the valley scattering process of free electrons or bound excitons is crucial for exploring excited state electron phonon interactions and...
Polytetrafluoroethylene (PTFE) has improved the efficiency and repeatability of nanosecond and picosecond laser processing technologies used in microelectronics and display glass manufacturing. In the field of precision manufacturing, the demand for efficient and repeatable processes is crucial. The laser structure of glass and laser ablation of silicon substrates are key areas where precision p...
EV Group, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, and Silicon Austria Labs, a leading electronic systems research center in Austria, announced that SAL has received and installed multiple EVG lithography and photoresist processing systems in its MicroFab at the R&D cleanroom facility in Filach, Austria.These devices...
With the rapid development of modern electronic information technology, integrated circuit chip packaging forms are also emerging in an endless stream, and the package density is getting higher and higher, which greatly promotes the development of electronic products to multi-function, high performance, high reliability and low cost.So far, through hole technology (THT) and surface mount technolog...