Veeco's Laser Pulse Annealing (LSA) System Selected for DRAM Evaluation

Veeco Instruments Inc. (NASDAQ: VECO) announced today that it has delivered its Laser Spike Annealing (LSA) system to a leading semiconductor memory company for evaluation by its advanced DRAM development team. This progress not only expands Veeco's business territory in the DRAM market, but also signifies a key advancement in the development of mass production technology for next-generation DRAM and high bandwidth memory (HBM). The expected evaluation period is about one year, and subsequent orders are expected to be fulfilled gradually from 2027 onwards.

“Our LSA platform is engineered to meet the rigorous demands of advanced DRAM and HBM production by providing higher productivity and superior performance,” said Adrian Devasahayam, Ph.D., Veeco’s Senior Vice President, Product Line Management. “This evaluation shipment underscores our commitment to enabling cutting-edge memory technologies, while providing an opportunity to expand our footprint in the memory market with this major customer.”

LSA is a millisecond annealing technology used in front-end semiconductor manufacturing to lower the resistance of key transistor structures by activating dopants. Veeco’s LSA system is capable of high-temperature annealing while staying within reduced thermal budgets of advanced devices at leading-edge nodes. The system delivers market-leading performance and best-in-class cost of ownership, making it a preferred solution for advanced memory applications. As the demand for HBM and DRAM continues to rise—driven by AI workloads and next-generation computing, Veeco’s LSA technology is positioned to support the evolving needs of tier 1 semiconductor manufacturers.

The HBM market is experiencing rapid growth, with Yole market research estimating that the market will grow at a compound annual growth rate (CAGR) of nearly 30% through 2030, reaching $100B or more in annualized revenues.

About Veeco
Veeco (NASDAQ: VECO) is an innovative manufacturer of semiconductor process equipment. Our proven ion beam, laser spike annealing, lithography, MOCVD and single wafer etch & clean technologies play an integral role in the fabrication and packaging of advanced semiconductor devices. With equipment designed to optimize performance, yield and cost of ownership, Veeco holds leading technology positions in the markets we serve. 

Source: GlobeNewswire