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According to South Korean media etnews, Samsung Electronics and SK Hynix have started the process technology conversion of high bandwidth memory (HBM) wafers, with the introduction of new technologies to prevent wafer warping as the core, which is considered to be aimed at the next generation HBM. It is expected that with the process transformation, the material and equipment supply chain will als...
Chip level ultrafast mode-locked laser based on nanophotonic lithium niobate.Researchers have created a compact mode-locked laser integrated into a nanophotonic platform, capable of generating high-power and ultrafast optical pulses. The breakthrough in miniaturization of MLL technology can significantly expand the application of photonics.Innovation in mode-locked laser technologyTo improve the t...
Topological laser (TL) is a laser device designed and manufactured using the principles of topological optics, which can produce a robust single-mode laser and is an ideal light source for future new optoelectronic integrated chips. Electrically pumped topology lasers have become a research hotspot due to their small size and ease of integration, but topology lasers based on electrical injection a...
The SCALA 3 LiDAR (Laser Detection and Ranging System), the third generation LiDAR scanner from Valeo, won the "Vehicle Technology and Advanced Mobile Mobility" Innovation Award at the 2024 CES Consumer Electronics Exhibition.The first and second generation Fareo LiDARs SCALA 1 and SCALA 2 have achieved autonomous driving in traffic congestion situations. The third-generation LiDAR SCALA 3 has sig...
In order to maintain relevance and success, companies with a long history must respect their past while not ignoring the future. This is the method adopted by Cincinnati Corporation (CI), a metal processing machinery manufacturer based in Harrison, Ohio, since its establishment in the late 1890s.The company is carefully considering technological changes. Incorrect selection of control hardware, ne...