- Không có dữ liệu
Tiếng Việt
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
The laser additive manufacturing technology of pure copper (Cu) with complex geometric shapes has opened up vast opportunities for the development of microelectronic and telecommunications functional devices. However, laser forming of high-density pure copper remains a challenge.Recently, the forefront of additive manufacturing technology has noticed a joint report by the University of Hong Kong, ...
Recently, HieFo, a leading enterprise in the field of optical communication, officially launched its HCL30 DFB laser chip, designed specifically to meet the stringent requirements of coherent optical transmission. This chip combines efficient optical output power with excellent narrow linewidth performance, providing multiple industry standard wavelength options in the O-band and C-band, bringin...
Recently, the launch and implementation plan demonstration meeting of the "Multimodal Nano Resolution Microscope" project led by Ningbo Yongxin Optics Co., Ltd. was successfully held in Ningbo. This is the fourth time Yongxin Optics has led a national key research and development plan project and received support, indicating that the company's ability to undertake national level technological rese...
Ortel belongs to the Photonics Foundries group and has launched its latest innovative product - the 1786 1550 nm laser module, aimed at significantly improving optical sensing in various applications. This laser module is designed specifically for continuous wavelength operation and is a key component of systems that require coherent light sources for precise sensing in environments with fluctuati...
According to South Korean media etnews, Samsung Electronics and SK Hynix have started the process technology conversion of high bandwidth memory (HBM) wafers, with the introduction of new technologies to prevent wafer warping as the core, which is considered to be aimed at the next generation HBM. It is expected that with the process transformation, the material and equipment supply chain will als...