- Không có dữ liệu
Tiếng Việt
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
Hybrid 3D integrated optical transceiver. (A, B) Test setup: Place the photon chip (PIC) on the circuit board (green), and glue the electronic chip (EIC) onto the top of the photon chip. (C) It is the cross-section of the EIC-PIC component with micro protrusions. (D) Display the mesh of the finite element model.The latest progress in artificial intelligence, more specifically, is the pressure plac...
The research from the University of West Virginia has been rewarded, as debris scattered in planetary orbits that pose a threat to spacecraft and satellites may be pushed away from potential collision paths by a coordinated space laser network.Hang Woon Lee, director of the Space Systems Operations Research Laboratory at the University of West Virginia, said that artificial debris dumps, including...
Scientists from the University of Hahn in Spain and the University of Santiago de Compostela conducted research to determine the most suitable semiconductor materials for high-power light transmission in terrestrial and underwater environments.HPOT, also known as laser power transfer, is a method of transmitting continuous power to a remote system using a monochromatic light source through an opti...
Dr. Yongcui Mi from Western University in Sweden has developed a new technology that enables real-time laser beam shaping and control for laser welding and directional energy deposition using laser and metal wire. This innovative technology draws on the mirror technology used in advanced astronomical telescopes.Adaptive beam shaping using deformable mirror technology (Image source: Western Univer...
Modern computer chips can construct nanoscale structures. So far, only these tiny structures can be formed on top of silicon chips, but now a new technology can create nanoscale structures in a layer beneath the surface. The inventor of this method stated that it has broad application prospects in the fields of photonics and electronics, and one day, people can manufacture 3D structures on the ent...