Lumentum acquires Hong Kong optical module manufacturer Cloud Light to expand its influence in cloud data centers and network infrastructure

It is reported that researchers from Nanyang Technological University in Singapore, Federal Institute of Technology Lausanne in Switzerland, Physics Laboratory of Higher Normal University in Paris, National Center for Scientific Research in France, Sorbonne University, City University of Paris, University of Leeds in the UK, and Korean Academy of Science and Technology (KAIST) have reported on the...

Organic electronics has aroused great interest in academia and industry due to its potential applications in OLEDs and organic solar cells, with advantages such as lightweight design, flexibility, and cost-effectiveness. These devices are made by depositing organic molecular thin films onto a substrate that serves as electrodes and exerting their effects by controlling electron transfer between th...

German researchers have developed a method for controlling and manipulating optical signals by embedding liquid crystal layers into waveguides created by direct laser writing. This work has produced devices capable of electro-optic control of polarization, which may open up possibilities for chip based devices and complex photonic circuits based on femtosecond write waveguides.Researcher Alexandro...

Many materials emit light in ways that encode information in its polarization. According to researchers at École Polytechnique Fédérale de Lausanne (EPFL), Switzerland, polarization is key for future technologies, from quantum computers to secure communication and holographic displays.Among such phenomena is a form known as circularly polarized luminescence (CPL), a special type of light emission ...

       近日，从江苏通用半导体有限公司传来消息，由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司，并投入生产。 图：8英寸SiC晶锭激光全自动剥离设备       该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片，包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集，一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白，突破了国外的技术封锁，将极大地提升我国碳化硅芯片产业的自主化、产业化水平。       该设备年可剥离碳化硅衬底20000片，实现良率95％以上，与传统的线切割工艺相比，大幅降低了产品损耗，而设备售价仅仅是国外同类产品的1／3。       近年来，碳化硅功率器件在大功率半导体市场中所占的份额不断提高，并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...