Türkçe

New technology can efficiently heal cracks in nickel based high-temperature alloys manufactured by laser additive manufacturing

527
2024-03-15 14:10:04
Çeviriyi gör

Recently, Professor Zhu Qiang's team from the Department of Mechanical and Energy Engineering at Southern University of Science and Technology published their latest research findings in the Journal of Materials Science. The research team has proposed a new process for liquid induced healing (LIH) laser additive manufacturing of cracks. By controlling micro remelting at grain boundaries to introduce interstitial liquid film filling defects, cracks in components can be "welded" at the microscale. This research achievement is of great significance for breaking through the industry challenge of laser additive manufacturing of high crack sensitivity alloys.

Paper graphic abstract


Liquid induced hearing of cracks in nickel based superalloy fabricated by laser powder bed fusion - ScienceDirect
Laser additive manufacturing is a revolutionary technology that solves the problem of personalized and complex metal component integral forming, with huge application prospects. However, only over ten out of the hundreds of commonly used engineering alloys can stably achieve crack free printing, which is far from meeting the needs of replacing traditional processes.

Compared to processes such as casting and welding, laser additive manufacturing technology has inherent properties of micro zone ultra normal metallurgy and rapid solidification, making it more prone to cracking. There are two existing methods to deal with cracks in laser additive manufacturing. One is to suppress cracks during the printing process by adjusting the alloy solidification range, grain morphology, and component temperature gradient. However, there are significant differences in the effectiveness of different alloy systems, with narrow process windows and poor stability, making it difficult to completely eliminate cracks; The second is to use hot isostatic pressing (HIP) post-treatment to close cracks. However, HIP cannot repair surface defects and requires further processing to remove surface materials, which undoubtedly weakens the core advantage of additive manufacturing technology in forming complex structures.

In addition, the extremely high working conditions make HIP equipment complex and extremely expensive, making it only suitable for a small number of high value-added metal additive manufacturing components.

In this regard, the research team proposed the liquid induced healing (LIH) technology based on the technical idea of introducing intergranular continuous liquid film to "weld" cracks, and verified the feasibility and progressiveness of the LIH technology by taking the typical high crack sensitivity alloy IN738LC as the test alloy. The research results showed that the mechanical properties of the alloy were significantly improved after LIH technology treatment. In terms of tensile properties, the LIH state is higher than the cast state and hot isostatic pressing state, while in terms of high-temperature creep, the LIH state alloy exhibits properties comparable to precision casting and far higher than the hot isostatic pressing state.

It is reported that compared with the most reliable HIP technology currently available, LIH technology has significant advantages in defect elimination efficiency, universality, convenience, and cost. Firstly, it breaks through the technical limitations of its inability to heal surface defects, making it suitable for pore healing treatment of complex components without the need for additional machining to remove the surface; Secondly, the pressure required by LIH is less than 1/20 of that of HIP technology, eliminating safety hazards of high-pressure special equipment and simplifying equipment construction and cost; Thirdly, there is no need for insulation treatment, while HIP needs to be insulated at high temperatures for several hours, thereby improving process efficiency and reducing energy consumption costs.

Source: Sohu

İlgili öneriler
  • The market accounts for up to 70%! Meere is continuously expanding its market layout

    According to Korean media reports, Meere, a semiconductor and display equipment manufacturer from South Korea, is continuously expanding its presence in the high stack semiconductor market, including its HBM business.In fact, Meere itself is the world's top manufacturer of display edge grinding mechanisms, with a market share of up to 70%. It is based on its accumulation of display microfabricatio...

    2024-06-25
    Çeviriyi gör
  • XLight raises $40 million in financing to develop new EUV light sources

    xLight, a US startup aiming to commercialize particle accelerator driven free electron lasers (FELs) for use in semiconductor production, says it has raised $40 million in a series B round of venture funding.The Palo Alto, California, firm said that the support would enable it to develop a prototype next-generation light source capable of emitting at extreme ultraviolet (EUV) wavelengths that are ...

    07-23
    Çeviriyi gör
  • APE 2025 is about to take place

    The Asia Optoelectronic Expo 2025 (APE 2025) will be held from February 26 to 28, 2025 at the Marina Bay Sands Convention and Exhibition Centre in Singapore. It covers products such as information and communication, optics, lasers, infrared, sensing, display, quantum, and is a one-stop optoelectronic comprehensive platform for the optoelectronic industry and application fields; The exhibition focu...

    02-18
    Çeviriyi gör
  • Lumiotive and Hokuyo announce the launch of the world's first 3D LiDAR sensor with true solid-state beam steering

    Lumotive, a pioneer in optical semiconductor technology, and Hokuyo Automatic Co., a global leader in sensors and automation, Ltd. announced today the commercial version of the YLM-10LX 3D LiDAR sensor. This breakthrough product features Lumiotive's light controlled metasurface (LCM) ™) Optical beamforming technology represents a significant leap in the application of solid-state programmable opti...

    2024-05-25
    Çeviriyi gör
  • Ultra short pulse laser technology shines a sword, winning 3.5 million euros in financing

    Recently, Italian startup Lithium Lasers announced that the company has successfully raised 3.5 million euros in ultra short pulse laser technology.This company, founded in 2019, focuses on developing an ultra short pulse laser (USPL) called FemtoFlash, which is aimed at multiple industries such as aerospace, healthcare, automotive, and consumer electronics, particularly suitable for material proc...

    2024-04-26
    Çeviriyi gör